Molecular dynamics modeling of diffusion bonding

Molecular dynamics simulations on diffusion bonding of Cu–Ag showed that the thickness of the interfacial region depended on the stress. The interfacial region became amorphous during diffusion bonding, and it would normally transform from amorphous into crystalline structure when the structure was...

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Veröffentlicht in:	Scripta materialia 2005-06, Vol.52 (11), p.1135-1140
Hauptverfasser:	Chen, S.D., Soh, A.K., Ke, F.J.
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Diffusion bonding EAM potential Exact sciences and technology Interface Metals. Metallurgy Molecular dynamics
Online-Zugang:	Volltext
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