A device for measurements of the temperature response to single discharges with high local resolution and fast response time
We report on a thermal device consisting of 14 thin film Au–Pd thermocouples designed to measure the transient temperature response of a sample (a thin 50 μm thick steel foil) submitted to a single discharge. Junctions as small as 4 μm 2 were patterned using standard photolithography. The distance b...
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Veröffentlicht in: | Sensors and actuators. A. Physical. 2005-02, Vol.118 (2), p.238-243 |
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creator | Revaz, B. Flükiger, R. Carron, J. Rappaz, M. |
description | We report on a thermal device consisting of 14 thin film Au–Pd thermocouples designed to measure the transient temperature response of a sample (a thin 50
μm thick steel foil) submitted to a single discharge. Junctions as small as 4
μm
2 were patterned using standard photolithography. The distance between the junctions (i.e. the local resolution of the device) is 20
μm. Using standard electron discharge machining (EDM) equipment, the temperature response due to a single discharge was measured. The maximum measured temperature was 280
°C for a thermocouple located on the backside of the steel foil at 61
μm from the center of the discharge. Large temperature gradients of 2.5 × 10
6
°C/m and quench rates of 5 × 10
5
°C/s have been measured. Analysis of the thermovoltage noise pattern allowed precise determination of the beginning and duration of the discharge. Preliminary results of the numerical calculations are given. |
doi_str_mv | 10.1016/j.sna.2004.08.016 |
format | Article |
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μm thick steel foil) submitted to a single discharge. Junctions as small as 4
μm
2 were patterned using standard photolithography. The distance between the junctions (i.e. the local resolution of the device) is 20
μm. Using standard electron discharge machining (EDM) equipment, the temperature response due to a single discharge was measured. The maximum measured temperature was 280
°C for a thermocouple located on the backside of the steel foil at 61
μm from the center of the discharge. Large temperature gradients of 2.5 × 10
6
°C/m and quench rates of 5 × 10
5
°C/s have been measured. Analysis of the thermovoltage noise pattern allowed precise determination of the beginning and duration of the discharge. Preliminary results of the numerical calculations are given.</description><identifier>ISSN: 0924-4247</identifier><identifier>EISSN: 1873-3069</identifier><identifier>DOI: 10.1016/j.sna.2004.08.016</identifier><language>eng</language><publisher>Elsevier B.V</publisher><subject>Electron discharge machining (EDM) ; Micromachining ; Thin film thermocouples ; Ultrafast cooling</subject><ispartof>Sensors and actuators. A. Physical., 2005-02, Vol.118 (2), p.238-243</ispartof><rights>2004 Elsevier B.V.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c328t-c420cb53b08d996fbe61e25d7a07d20fdf09afa799d6428861675583f5a78b6e3</citedby><cites>FETCH-LOGICAL-c328t-c420cb53b08d996fbe61e25d7a07d20fdf09afa799d6428861675583f5a78b6e3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://dx.doi.org/10.1016/j.sna.2004.08.016$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,778,782,3539,27907,27908,45978</link.rule.ids></links><search><creatorcontrib>Revaz, B.</creatorcontrib><creatorcontrib>Flükiger, R.</creatorcontrib><creatorcontrib>Carron, J.</creatorcontrib><creatorcontrib>Rappaz, M.</creatorcontrib><title>A device for measurements of the temperature response to single discharges with high local resolution and fast response time</title><title>Sensors and actuators. A. Physical.</title><description>We report on a thermal device consisting of 14 thin film Au–Pd thermocouples designed to measure the transient temperature response of a sample (a thin 50
μm thick steel foil) submitted to a single discharge. Junctions as small as 4
μm
2 were patterned using standard photolithography. The distance between the junctions (i.e. the local resolution of the device) is 20
μm. Using standard electron discharge machining (EDM) equipment, the temperature response due to a single discharge was measured. The maximum measured temperature was 280
°C for a thermocouple located on the backside of the steel foil at 61
μm from the center of the discharge. Large temperature gradients of 2.5 × 10
6
°C/m and quench rates of 5 × 10
5
°C/s have been measured. Analysis of the thermovoltage noise pattern allowed precise determination of the beginning and duration of the discharge. Preliminary results of the numerical calculations are given.</description><subject>Electron discharge machining (EDM)</subject><subject>Micromachining</subject><subject>Thin film thermocouples</subject><subject>Ultrafast cooling</subject><issn>0924-4247</issn><issn>1873-3069</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2005</creationdate><recordtype>article</recordtype><recordid>eNp9kE9r3DAUxEVJoZu0H6A3nXKzqz-2JZNTCE1aCOTSnoVWelprsa2tnjYlkA9fLZtDTzk9-DEzzBtCvnLWcsaHb_sWV9sKxrqW6baSD2TDtZKNZMN4QTZsFF3TiU59IpeIe8aYlEptyOst9fAcHdCQMl3A4jHDAmtBmgItE9ACywGyLZXTDHhIK1aYKMZ1NwP1Ed1k8w6Q_o1lolPcTXROzs4ndZqPJaaV2tXTYLH8lxAX-Ew-BjsjfHm7V-T3_fdfdz-ax6eHn3e3j42TQpfGdYK5bS-3TPtxHMIWBg6i98oy5QULPrDRBqvG0Q-d0Hrgg-p7LUNvld4OIK_I9Tn3kNOfI2AxS20N82xXSEc0Qvei51JWIT8LXU6IGYI55LjY_GI4M6edzd7Unc1pZ8O0qaR6bs4eqB88R8gGXYTVgY8ZXDE-xXfc_wDwVoho</recordid><startdate>20050228</startdate><enddate>20050228</enddate><creator>Revaz, B.</creator><creator>Flükiger, R.</creator><creator>Carron, J.</creator><creator>Rappaz, M.</creator><general>Elsevier B.V</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SC</scope><scope>7TB</scope><scope>7U5</scope><scope>8BQ</scope><scope>8FD</scope><scope>FR3</scope><scope>JG9</scope><scope>JQ2</scope><scope>L7M</scope><scope>L~C</scope><scope>L~D</scope></search><sort><creationdate>20050228</creationdate><title>A device for measurements of the temperature response to single discharges with high local resolution and fast response time</title><author>Revaz, B. ; Flükiger, R. ; Carron, J. ; Rappaz, M.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c328t-c420cb53b08d996fbe61e25d7a07d20fdf09afa799d6428861675583f5a78b6e3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2005</creationdate><topic>Electron discharge machining (EDM)</topic><topic>Micromachining</topic><topic>Thin film thermocouples</topic><topic>Ultrafast cooling</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Revaz, B.</creatorcontrib><creatorcontrib>Flükiger, R.</creatorcontrib><creatorcontrib>Carron, J.</creatorcontrib><creatorcontrib>Rappaz, M.</creatorcontrib><collection>CrossRef</collection><collection>Computer and Information Systems Abstracts</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Engineering Research Database</collection><collection>Materials Research Database</collection><collection>ProQuest Computer Science Collection</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Computer and Information Systems Abstracts Academic</collection><collection>Computer and Information Systems Abstracts Professional</collection><jtitle>Sensors and actuators. A. Physical.</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Revaz, B.</au><au>Flükiger, R.</au><au>Carron, J.</au><au>Rappaz, M.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>A device for measurements of the temperature response to single discharges with high local resolution and fast response time</atitle><jtitle>Sensors and actuators. A. Physical.</jtitle><date>2005-02-28</date><risdate>2005</risdate><volume>118</volume><issue>2</issue><spage>238</spage><epage>243</epage><pages>238-243</pages><issn>0924-4247</issn><eissn>1873-3069</eissn><abstract>We report on a thermal device consisting of 14 thin film Au–Pd thermocouples designed to measure the transient temperature response of a sample (a thin 50
μm thick steel foil) submitted to a single discharge. Junctions as small as 4
μm
2 were patterned using standard photolithography. The distance between the junctions (i.e. the local resolution of the device) is 20
μm. Using standard electron discharge machining (EDM) equipment, the temperature response due to a single discharge was measured. The maximum measured temperature was 280
°C for a thermocouple located on the backside of the steel foil at 61
μm from the center of the discharge. Large temperature gradients of 2.5 × 10
6
°C/m and quench rates of 5 × 10
5
°C/s have been measured. Analysis of the thermovoltage noise pattern allowed precise determination of the beginning and duration of the discharge. Preliminary results of the numerical calculations are given.</abstract><pub>Elsevier B.V</pub><doi>10.1016/j.sna.2004.08.016</doi><tpages>6</tpages></addata></record> |
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source | Elsevier ScienceDirect Journals |
subjects | Electron discharge machining (EDM) Micromachining Thin film thermocouples Ultrafast cooling |
title | A device for measurements of the temperature response to single discharges with high local resolution and fast response time |
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