Effect of trace phosphorous on tensile behavior of accumulative roll bonded oxygen-free copper

Effect of trace phosphorous on tensile behavior of accumulative roll bonded oxygen-free copper

In the present study, the effect of trace phosphorous on the tensile behavior of nano grain-sized oxygen free copper produced by accumulative roll bonding was examined. It was found that the trace phosphorous substantially changed the tensile behavior of the present material by affecting the dynamic...

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Veröffentlicht in:Scripta materialia 2005, Vol.52 (1), p.21-24
Hauptverfasser: Jang, Y.H., Kim, S.S., Han, S.Z., Lim, C.Y., Kim, C.J., Goto, M.
Format: Artikel
Sprache:eng
Schlagworte:
Accumulative roll bonding
Applied sciences
Exact sciences and technology
Metals. Metallurgy
Oxygen-free copper
Tensile behavior
Trace phosphorous
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container_end_page 24
container_issue 1
container_start_page 21
container_title Scripta materialia
container_volume 52
creator Jang, Y.H.
Kim, S.S.
Han, S.Z.
Lim, C.Y.
Kim, C.J.
Goto, M.
description In the present study, the effect of trace phosphorous on the tensile behavior of nano grain-sized oxygen free copper produced by accumulative roll bonding was examined. It was found that the trace phosphorous substantially changed the tensile behavior of the present material by affecting the dynamic recovery during severe plastic deformation.
doi_str_mv 10.1016/j.scriptamat.2004.09.005
format Article
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source Elsevier ScienceDirect Journals
subjects Accumulative roll bonding
Applied sciences
Exact sciences and technology
Metals. Metallurgy
Oxygen-free copper
Tensile behavior
Trace phosphorous
title Effect of trace phosphorous on tensile behavior of accumulative roll bonded oxygen-free copper
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