Effect of trace phosphorous on tensile behavior of accumulative roll bonded oxygen-free copper

In the present study, the effect of trace phosphorous on the tensile behavior of nano grain-sized oxygen free copper produced by accumulative roll bonding was examined. It was found that the trace phosphorous substantially changed the tensile behavior of the present material by affecting the dynamic...

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Veröffentlicht in:	Scripta materialia 2005, Vol.52 (1), p.21-24
Hauptverfasser:	Jang, Y.H., Kim, S.S., Han, S.Z., Lim, C.Y., Kim, C.J., Goto, M.
Format:	Artikel
Sprache:	eng
Schlagworte:	Accumulative roll bonding Applied sciences Exact sciences and technology Metals. Metallurgy Oxygen-free copper Tensile behavior Trace phosphorous
Online-Zugang:	Volltext
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Zusammenfassung:	In the present study, the effect of trace phosphorous on the tensile behavior of nano grain-sized oxygen free copper produced by accumulative roll bonding was examined. It was found that the trace phosphorous substantially changed the tensile behavior of the present material by affecting the dynamic recovery during severe plastic deformation.
ISSN:	1359-6462 1872-8456
DOI:	10.1016/j.scriptamat.2004.09.005