A new asymmetrical halo source GOLD drain (HS-GOLD) deep sub-half-micrometer n-MOSFET design for reliability and performance

An asymmetrical n-MOSFET device structure was developed that is suitable, in terms of reliability and performance, for scaling down to the sub-quarter-micrometer level without reduction of the supply voltage below 3.5 V. In this structure, large-tilt implantation is used to form the gate-overlapped...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:IEEE transactions on electron devices 1991-08, Vol.38 (8), p.1757-1764
Hauptverfasser: Buti, T.N., Ogura, S., Rovedo, N., Tobimatsu, K.
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:An asymmetrical n-MOSFET device structure was developed that is suitable, in terms of reliability and performance, for scaling down to the sub-quarter-micrometer level without reduction of the supply voltage below 3.5 V. In this structure, large-tilt implantation is used to form the gate-overlapped LDD (GOLD) region at the drain electrode only. A halo (punchthrough stopper) is used at the source, but not at the drain. Superior hot carrier reliability and high punchthrough resistance are obtained using this device structure. A reliability-limited supply voltage of 4.2 V is obtained for an asymmetrical n-MOSFET with effective channel lengths as short as 0.25 mu m. By extrapolation from the measured threshold roll-off characteristics, the authors expect that this structure can be designed with substantially shorter channel length while maintaining the 3.5-V supply voltage.< >
ISSN:0018-9383
1557-9646
DOI:10.1109/16.119011