Experimental determination of residual stress in silicon nitride diffusion bonds obtained by high-energy X-ray diffraction

High resolution X-ray scanning diffractometry has been used to study the residual strain in binary metal/ceramic (Ni/Si 3N 4) and ceramic/ceramic (Si 3N 4/Ni thin film/Si 3N 4) diffusion bonds. Bonds were fabricated by simultaneous high temperature heating and uniaxial pressing. The axial and radial...

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Veröffentlicht in:Powder technology 2004-10, Vol.148 (1), p.60-63
Hauptverfasser: Vila, M., Martínez, M.L., Prieto, C., Miranzo, P., Osendi, M.I., Terry, A., Vaughan, G.
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Sprache:eng
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