Interface irregularity and texture evolution of Bi-Sr-Ca-Cu-O superconductor tape processed by PIT method
We evaluated the degree of texture and the interface irregularity between the Ag sheath and the superconductor core of Bi-Sr-Ca-Cu-O (BSCCO) superconductor tape during drawing and rolling processes. The degree of texture and the interface irregularity were characterized by pole figure analysis and t...
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| Veröffentlicht in: | IEEE transactions on applied superconductivity 2001-03, Vol.11 (1), p.3760-3763 |
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| container_title | IEEE transactions on applied superconductivity |
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| creator | Ji, Bong Ki Park, Hyung Sang Oh, Seung Jin Joo, Jinho Nah, Wansoo Park, No-Jin Hong, Gye-Won |
| description | We evaluated the degree of texture and the interface irregularity between the Ag sheath and the superconductor core of Bi-Sr-Ca-Cu-O (BSCCO) superconductor tape during drawing and rolling processes. The degree of texture and the interface irregularity were characterized by pole figure analysis and the coefficient of variation in thickness (COV) factor, respectively. It was observed that the interface became gradually irregular during the drawing and rolling processes. On the other hand, the degree of texture improved significantly during rolling process, but little during the drawing process. The critical current of the tape depended remarkably on the combined effects of the interface irregularity and the degree of texture. As the dimension of the wire/tape was changed from a diameter of 3.25 mm to a thickness of 0.20 mm, the critical current increased by 10 times. Microstructural investigation showed that grain alignment was locally degraded by the existence of both second phases and interface irregularity. It was observed that larger grain size and better texturing developed near the relatively straight interface compared to those inside the superconducting core. |
| doi_str_mv | 10.1109/77.919882 |
| format | Article |
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The degree of texture and the interface irregularity were characterized by pole figure analysis and the coefficient of variation in thickness (COV) factor, respectively. It was observed that the interface became gradually irregular during the drawing and rolling processes. On the other hand, the degree of texture improved significantly during rolling process, but little during the drawing process. The critical current of the tape depended remarkably on the combined effects of the interface irregularity and the degree of texture. As the dimension of the wire/tape was changed from a diameter of 3.25 mm to a thickness of 0.20 mm, the critical current increased by 10 times. Microstructural investigation showed that grain alignment was locally degraded by the existence of both second phases and interface irregularity. It was observed that larger grain size and better texturing developed near the relatively straight interface compared to those inside the superconducting core.</description><identifier>ISSN: 1051-8223</identifier><identifier>EISSN: 1558-2515</identifier><identifier>DOI: 10.1109/77.919882</identifier><identifier>CODEN: ITASE9</identifier><language>eng</language><publisher>New York, NY: IEEE</publisher><subject>Applied sciences ; Bismuth compounds ; Conductors ; Critical current ; Electrical engineering. Electrical power engineering ; Exact sciences and technology ; Grain size ; Inorganic materials ; INTERFACES ; Irregularities ; Materials ; Mechanical factors ; Power engineering and energy ; Power system reliability ; Silver ; Superconducting cables ; Superconducting films ; Superconducting magnetic energy storage ; Superconducting tapes ; SUPERCONDUCTIVITY ; SUPERCONDUCTORS ; Surface layer ; TAPE ; Texture ; TEXTURES</subject><ispartof>IEEE transactions on applied superconductivity, 2001-03, Vol.11 (1), p.3760-3763</ispartof><rights>2001 INIST-CNRS</rights><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2001</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c366t-f255393ce1c86db5c768fd405eb8ab33684d400daf7ffddf262b998e9c79fcf83</citedby><cites>FETCH-LOGICAL-c366t-f255393ce1c86db5c768fd405eb8ab33684d400daf7ffddf262b998e9c79fcf83</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/919882$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,314,776,780,785,786,792,23910,23911,25119,27903,27904,54736</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/919882$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=966140$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Ji, Bong Ki</creatorcontrib><creatorcontrib>Park, Hyung Sang</creatorcontrib><creatorcontrib>Oh, Seung Jin</creatorcontrib><creatorcontrib>Joo, Jinho</creatorcontrib><creatorcontrib>Nah, Wansoo</creatorcontrib><creatorcontrib>Park, No-Jin</creatorcontrib><creatorcontrib>Hong, Gye-Won</creatorcontrib><title>Interface irregularity and texture evolution of Bi-Sr-Ca-Cu-O superconductor tape processed by PIT method</title><title>IEEE transactions on applied superconductivity</title><addtitle>TASC</addtitle><description>We evaluated the degree of texture and the interface irregularity between the Ag sheath and the superconductor core of Bi-Sr-Ca-Cu-O (BSCCO) superconductor tape during drawing and rolling processes. The degree of texture and the interface irregularity were characterized by pole figure analysis and the coefficient of variation in thickness (COV) factor, respectively. It was observed that the interface became gradually irregular during the drawing and rolling processes. On the other hand, the degree of texture improved significantly during rolling process, but little during the drawing process. The critical current of the tape depended remarkably on the combined effects of the interface irregularity and the degree of texture. As the dimension of the wire/tape was changed from a diameter of 3.25 mm to a thickness of 0.20 mm, the critical current increased by 10 times. Microstructural investigation showed that grain alignment was locally degraded by the existence of both second phases and interface irregularity. It was observed that larger grain size and better texturing developed near the relatively straight interface compared to those inside the superconducting core.</description><subject>Applied sciences</subject><subject>Bismuth compounds</subject><subject>Conductors</subject><subject>Critical current</subject><subject>Electrical engineering. Electrical power engineering</subject><subject>Exact sciences and technology</subject><subject>Grain size</subject><subject>Inorganic materials</subject><subject>INTERFACES</subject><subject>Irregularities</subject><subject>Materials</subject><subject>Mechanical factors</subject><subject>Power engineering and energy</subject><subject>Power system reliability</subject><subject>Silver</subject><subject>Superconducting cables</subject><subject>Superconducting films</subject><subject>Superconducting magnetic energy storage</subject><subject>Superconducting tapes</subject><subject>SUPERCONDUCTIVITY</subject><subject>SUPERCONDUCTORS</subject><subject>Surface layer</subject><subject>TAPE</subject><subject>Texture</subject><subject>TEXTURES</subject><issn>1051-8223</issn><issn>1558-2515</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2001</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNp9kc9rFTEQx5dSwbZ68NpTaEHxkJpk8_OoD388KFSwnpdsMtGUfZtnfojvv3fLlgo9eJoZ5jPfmeHbda8ouaKUmHdKXRlqtGZH3QkVQmMmqDheciIo1oz1z7vTUu4IoVxzcdLF7VwhB-sAxZzhR5tsjvWA7OxRhT-1ZUDwO02txjSjFNCHiL9lvLF40_ANKm0P2aXZN1dTRtXuAe1zclAKeDQe0NftLdpB_Zn8i-5ZsFOBlw_xrPv-6ePt5gu-vvm83by_xq6XsuLAhOhN74A6Lf0onJI6eE4EjNqOfS81XyribVAheB-YZKMxGoxTJrig-7Puzaq73PGrQanDLhYH02RnSK0MhnLJldZyIV__l2SaS6YYX8CLJ-BdanlevhiM6RVRht7vfbtCLqdSMoRhn-PO5sNAyXDvzaDUsHqzsJcPgrY4O4VsZxfL44CRknKyUOcrFQHgX3OV-AuEkpYo</recordid><startdate>20010301</startdate><enddate>20010301</enddate><creator>Ji, Bong Ki</creator><creator>Park, Hyung Sang</creator><creator>Oh, Seung Jin</creator><creator>Joo, Jinho</creator><creator>Nah, Wansoo</creator><creator>Park, No-Jin</creator><creator>Hong, Gye-Won</creator><general>IEEE</general><general>Institute of Electrical and Electronics Engineers</general><general>The Institute of Electrical and Electronics Engineers, Inc. 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Electrical power engineering</topic><topic>Exact sciences and technology</topic><topic>Grain size</topic><topic>Inorganic materials</topic><topic>INTERFACES</topic><topic>Irregularities</topic><topic>Materials</topic><topic>Mechanical factors</topic><topic>Power engineering and energy</topic><topic>Power system reliability</topic><topic>Silver</topic><topic>Superconducting cables</topic><topic>Superconducting films</topic><topic>Superconducting magnetic energy storage</topic><topic>Superconducting tapes</topic><topic>SUPERCONDUCTIVITY</topic><topic>SUPERCONDUCTORS</topic><topic>Surface layer</topic><topic>TAPE</topic><topic>Texture</topic><topic>TEXTURES</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Ji, Bong Ki</creatorcontrib><creatorcontrib>Park, Hyung Sang</creatorcontrib><creatorcontrib>Oh, Seung Jin</creatorcontrib><creatorcontrib>Joo, Jinho</creatorcontrib><creatorcontrib>Nah, Wansoo</creatorcontrib><creatorcontrib>Park, No-Jin</creatorcontrib><creatorcontrib>Hong, Gye-Won</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><collection>Copper Technical Reference Library</collection><collection>Materials Research Database</collection><jtitle>IEEE transactions on applied superconductivity</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Ji, Bong Ki</au><au>Park, Hyung Sang</au><au>Oh, Seung Jin</au><au>Joo, Jinho</au><au>Nah, Wansoo</au><au>Park, No-Jin</au><au>Hong, Gye-Won</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Interface irregularity and texture evolution of Bi-Sr-Ca-Cu-O superconductor tape processed by PIT method</atitle><jtitle>IEEE transactions on applied superconductivity</jtitle><stitle>TASC</stitle><date>2001-03-01</date><risdate>2001</risdate><volume>11</volume><issue>1</issue><spage>3760</spage><epage>3763</epage><pages>3760-3763</pages><issn>1051-8223</issn><eissn>1558-2515</eissn><coden>ITASE9</coden><abstract>We evaluated the degree of texture and the interface irregularity between the Ag sheath and the superconductor core of Bi-Sr-Ca-Cu-O (BSCCO) superconductor tape during drawing and rolling processes. The degree of texture and the interface irregularity were characterized by pole figure analysis and the coefficient of variation in thickness (COV) factor, respectively. It was observed that the interface became gradually irregular during the drawing and rolling processes. On the other hand, the degree of texture improved significantly during rolling process, but little during the drawing process. The critical current of the tape depended remarkably on the combined effects of the interface irregularity and the degree of texture. As the dimension of the wire/tape was changed from a diameter of 3.25 mm to a thickness of 0.20 mm, the critical current increased by 10 times. Microstructural investigation showed that grain alignment was locally degraded by the existence of both second phases and interface irregularity. It was observed that larger grain size and better texturing developed near the relatively straight interface compared to those inside the superconducting core.</abstract><cop>New York, NY</cop><pub>IEEE</pub><doi>10.1109/77.919882</doi><tpages>4</tpages></addata></record> |
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| subjects | Applied sciences Bismuth compounds Conductors Critical current Electrical engineering. Electrical power engineering Exact sciences and technology Grain size Inorganic materials INTERFACES Irregularities Materials Mechanical factors Power engineering and energy Power system reliability Silver Superconducting cables Superconducting films Superconducting magnetic energy storage Superconducting tapes SUPERCONDUCTIVITY SUPERCONDUCTORS Surface layer TAPE Texture TEXTURES |
| title | Interface irregularity and texture evolution of Bi-Sr-Ca-Cu-O superconductor tape processed by PIT method |
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