Evaluation of Cutting Forces for Intermetallic Compounds Formed on Solder Joint Interface by Instrumented Ultramicrotome

Observing interface states is especially important in evaluating solder joint reliability. Cross-section samples of intermetallic compounds generated by copper metallization with lead-free solders (Sn8Zn3Bi, and Sn9Zn, Sn3Ag0.5Cu), with Sn37Pb as a reference, were prepared using an ultramicrotome. W...

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Veröffentlicht in:	Journal of the Japan Institute of Metals and Materials 2004, Vol.68(5), pp.282-287
Hauptverfasser:	Yorita, Chiko, Imamura, Yuko, Hirohata, Yasuhisa, Asakura, Kentaro
Format:	Artikel
Sprache:	jpn
Schlagworte:	Cutting force profile instrumented ultramicrotome intermetallic compound solder joint reliability lead-free solder ultramicrotome
Online-Zugang:	Volltext
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