Thermal deformation analysis of electronic packaging by viscoplastic constitutive model (comparison of lead solder alloys with lead free solder alloys)
In this paper, experimental and theoretical researches on the viscoplasticity of lead and lead-free solder alloys are conducted. First, experiments such as tension-compression loading with several stress amplitudes and strain rates, creep tests at several stress levels, and stress relaxation tests a...
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| Veröffentlicht in: | Nihon Kikai Gakkai ronbunshū. A 2004-01, Vol.16 (1), p.147-154 |
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| Hauptverfasser: | , , |
| Format: | Artikel |
| Sprache: | jpn |
| Online-Zugang: | Volltext |
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