Lubrication process solvent moisture study
To characterize the sensitivity of lubricant films to process solvent and moisture, a four-factor matrix study was conducted with solvent type, moisture level, lubricant type and X-1P additive as the variables. Lubricant bonding ratio (LBR), X-1P retention ratio, and water-contact angle measurements...
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| Veröffentlicht in: | IEEE transactions on magnetics 2002-09, Vol.38 (5), p.2114-2116 |
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| container_title | IEEE transactions on magnetics |
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| creator | Chen, S.H. Shin, B. Chao, J. Rajtar, P.E. Kehren, J.M. |
| description | To characterize the sensitivity of lubricant films to process solvent and moisture, a four-factor matrix study was conducted with solvent type, moisture level, lubricant type and X-1P additive as the variables. Lubricant bonding ratio (LBR), X-1P retention ratio, and water-contact angle measurements were used to characterize the lubricant films, and contact start-stop (CSS) tests were used to evaluate the tribological performance. The differences in LBR and contact angle were relatively small compared with the natural trends over time, but we were able to observe transient effects of water moisture interacting with solvent type and lubricant type. These transient effects could be interpreted as due to the adsorbed layer of water molecules. We also observed differences in the bonding behavior of AM3001 and Z-Dol lubricants that is not related to solvent and moisture. In addition, we found that X-1P has a positive effect on both lubricant bonding and contact angle. CSS tests showed that the transient effects of solvent moisture level have no significant effect on the performance of the lubricant films. We can ensure good tribological performance as long as we are able to precisely control the lubricant and X-1P thickness. |
| doi_str_mv | 10.1109/TMAG.2002.802837 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_RIE</sourceid><recordid>TN_cdi_proquest_miscellaneous_28339796</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>1042108</ieee_id><sourcerecordid>28339796</sourcerecordid><originalsourceid>FETCH-LOGICAL-c349t-ea651d559bbd5e9223a000a50b2f068b9dd60ee17d9bfa27a53ebf57e6aadb043</originalsourceid><addsrcrecordid>eNpdkM1Lw0AQxRdRsFbvgpci6EFInf3M7rEUrULFSz0vu8kEUtKk7iZC_3u3RFC8zDDwe495j5BrCnNKwTxu3harOQNgcw1M8_yETKgRNANQ5pRMAKjOjFDinFzEuE2nkBQm5GE9-FAXrq-7drYPXYExzmLXfGHbz3ZdHfsh4CzN8nBJzirXRLz62VPy8fy0Wb5k6_fV63KxzgouTJ-hU5KWUhrvS4mGMe4AwEnwrAKlvSlLBYg0L42vHMud5OgrmaNyrvQg-JTcj77pnc8BY293dSywaVyL3RBtSsdNblQCb_-B224IbfrNap3iCZXrBMEIFaGLMWBl96HeuXCwFOyxOXtszh6bs2NzSXL34-ti4ZoquLao46-OG6OYlom7GbkaEf_YCkZB82_OGHZc</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>884514678</pqid></control><display><type>article</type><title>Lubrication process solvent moisture study</title><source>IEEE/IET Electronic Library (IEL)</source><creator>Chen, S.H. ; Shin, B. ; Chao, J. ; Rajtar, P.E. ; Kehren, J.M.</creator><creatorcontrib>Chen, S.H. ; Shin, B. ; Chao, J. ; Rajtar, P.E. ; Kehren, J.M.</creatorcontrib><description>To characterize the sensitivity of lubricant films to process solvent and moisture, a four-factor matrix study was conducted with solvent type, moisture level, lubricant type and X-1P additive as the variables. Lubricant bonding ratio (LBR), X-1P retention ratio, and water-contact angle measurements were used to characterize the lubricant films, and contact start-stop (CSS) tests were used to evaluate the tribological performance. The differences in LBR and contact angle were relatively small compared with the natural trends over time, but we were able to observe transient effects of water moisture interacting with solvent type and lubricant type. These transient effects could be interpreted as due to the adsorbed layer of water molecules. We also observed differences in the bonding behavior of AM3001 and Z-Dol lubricants that is not related to solvent and moisture. In addition, we found that X-1P has a positive effect on both lubricant bonding and contact angle. CSS tests showed that the transient effects of solvent moisture level have no significant effect on the performance of the lubricant films. We can ensure good tribological performance as long as we are able to precisely control the lubricant and X-1P thickness.</description><identifier>ISSN: 0018-9464</identifier><identifier>EISSN: 1941-0069</identifier><identifier>DOI: 10.1109/TMAG.2002.802837</identifier><identifier>CODEN: IEMGAQ</identifier><language>eng</language><publisher>New York, NY: IEEE</publisher><subject>Applied sciences ; Bonding ; Cascading style sheets ; Conductive films ; Contact angle ; Electronics ; Exact sciences and technology ; Goniometers ; Lubricants ; Lubricants & lubrication ; Lubrication ; Magnetic and optical mass memories ; Magnetism ; Moisture ; Other magnetic recording and storage devices (including tapes, disks, and drums) ; Solvents ; Storage and reproduction of information ; Testing ; Thickness control</subject><ispartof>IEEE transactions on magnetics, 2002-09, Vol.38 (5), p.2114-2116</ispartof><rights>2003 INIST-CNRS</rights><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2002</rights><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c349t-ea651d559bbd5e9223a000a50b2f068b9dd60ee17d9bfa27a53ebf57e6aadb043</citedby><cites>FETCH-LOGICAL-c349t-ea651d559bbd5e9223a000a50b2f068b9dd60ee17d9bfa27a53ebf57e6aadb043</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/1042108$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,314,780,784,789,790,796,23930,23931,25140,27924,27925,54758</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/1042108$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=13996285$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Chen, S.H.</creatorcontrib><creatorcontrib>Shin, B.</creatorcontrib><creatorcontrib>Chao, J.</creatorcontrib><creatorcontrib>Rajtar, P.E.</creatorcontrib><creatorcontrib>Kehren, J.M.</creatorcontrib><title>Lubrication process solvent moisture study</title><title>IEEE transactions on magnetics</title><addtitle>TMAG</addtitle><description>To characterize the sensitivity of lubricant films to process solvent and moisture, a four-factor matrix study was conducted with solvent type, moisture level, lubricant type and X-1P additive as the variables. Lubricant bonding ratio (LBR), X-1P retention ratio, and water-contact angle measurements were used to characterize the lubricant films, and contact start-stop (CSS) tests were used to evaluate the tribological performance. The differences in LBR and contact angle were relatively small compared with the natural trends over time, but we were able to observe transient effects of water moisture interacting with solvent type and lubricant type. These transient effects could be interpreted as due to the adsorbed layer of water molecules. We also observed differences in the bonding behavior of AM3001 and Z-Dol lubricants that is not related to solvent and moisture. In addition, we found that X-1P has a positive effect on both lubricant bonding and contact angle. CSS tests showed that the transient effects of solvent moisture level have no significant effect on the performance of the lubricant films. We can ensure good tribological performance as long as we are able to precisely control the lubricant and X-1P thickness.</description><subject>Applied sciences</subject><subject>Bonding</subject><subject>Cascading style sheets</subject><subject>Conductive films</subject><subject>Contact angle</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Goniometers</subject><subject>Lubricants</subject><subject>Lubricants & lubrication</subject><subject>Lubrication</subject><subject>Magnetic and optical mass memories</subject><subject>Magnetism</subject><subject>Moisture</subject><subject>Other magnetic recording and storage devices (including tapes, disks, and drums)</subject><subject>Solvents</subject><subject>Storage and reproduction of information</subject><subject>Testing</subject><subject>Thickness control</subject><issn>0018-9464</issn><issn>1941-0069</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2002</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNpdkM1Lw0AQxRdRsFbvgpci6EFInf3M7rEUrULFSz0vu8kEUtKk7iZC_3u3RFC8zDDwe495j5BrCnNKwTxu3harOQNgcw1M8_yETKgRNANQ5pRMAKjOjFDinFzEuE2nkBQm5GE9-FAXrq-7drYPXYExzmLXfGHbz3ZdHfsh4CzN8nBJzirXRLz62VPy8fy0Wb5k6_fV63KxzgouTJ-hU5KWUhrvS4mGMe4AwEnwrAKlvSlLBYg0L42vHMud5OgrmaNyrvQg-JTcj77pnc8BY293dSywaVyL3RBtSsdNblQCb_-B224IbfrNap3iCZXrBMEIFaGLMWBl96HeuXCwFOyxOXtszh6bs2NzSXL34-ti4ZoquLao46-OG6OYlom7GbkaEf_YCkZB82_OGHZc</recordid><startdate>20020901</startdate><enddate>20020901</enddate><creator>Chen, S.H.</creator><creator>Shin, B.</creator><creator>Chao, J.</creator><creator>Rajtar, P.E.</creator><creator>Kehren, J.M.</creator><general>IEEE</general><general>Institute of Electrical and Electronics Engineers</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>RIA</scope><scope>RIE</scope><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>7U5</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope><scope>L7M</scope></search><sort><creationdate>20020901</creationdate><title>Lubrication process solvent moisture study</title><author>Chen, S.H. ; Shin, B. ; Chao, J. ; Rajtar, P.E. ; Kehren, J.M.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c349t-ea651d559bbd5e9223a000a50b2f068b9dd60ee17d9bfa27a53ebf57e6aadb043</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2002</creationdate><topic>Applied sciences</topic><topic>Bonding</topic><topic>Cascading style sheets</topic><topic>Conductive films</topic><topic>Contact angle</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Goniometers</topic><topic>Lubricants</topic><topic>Lubricants & lubrication</topic><topic>Lubrication</topic><topic>Magnetic and optical mass memories</topic><topic>Magnetism</topic><topic>Moisture</topic><topic>Other magnetic recording and storage devices (including tapes, disks, and drums)</topic><topic>Solvents</topic><topic>Storage and reproduction of information</topic><topic>Testing</topic><topic>Thickness control</topic><toplevel>online_resources</toplevel><creatorcontrib>Chen, S.H.</creatorcontrib><creatorcontrib>Shin, B.</creatorcontrib><creatorcontrib>Chao, J.</creatorcontrib><creatorcontrib>Rajtar, P.E.</creatorcontrib><creatorcontrib>Kehren, J.M.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) Online</collection><collection>IEEE/IET Electronic Library (IEL)</collection><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>IEEE transactions on magnetics</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Chen, S.H.</au><au>Shin, B.</au><au>Chao, J.</au><au>Rajtar, P.E.</au><au>Kehren, J.M.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Lubrication process solvent moisture study</atitle><jtitle>IEEE transactions on magnetics</jtitle><stitle>TMAG</stitle><date>2002-09-01</date><risdate>2002</risdate><volume>38</volume><issue>5</issue><spage>2114</spage><epage>2116</epage><pages>2114-2116</pages><issn>0018-9464</issn><eissn>1941-0069</eissn><coden>IEMGAQ</coden><abstract>To characterize the sensitivity of lubricant films to process solvent and moisture, a four-factor matrix study was conducted with solvent type, moisture level, lubricant type and X-1P additive as the variables. Lubricant bonding ratio (LBR), X-1P retention ratio, and water-contact angle measurements were used to characterize the lubricant films, and contact start-stop (CSS) tests were used to evaluate the tribological performance. The differences in LBR and contact angle were relatively small compared with the natural trends over time, but we were able to observe transient effects of water moisture interacting with solvent type and lubricant type. These transient effects could be interpreted as due to the adsorbed layer of water molecules. We also observed differences in the bonding behavior of AM3001 and Z-Dol lubricants that is not related to solvent and moisture. In addition, we found that X-1P has a positive effect on both lubricant bonding and contact angle. CSS tests showed that the transient effects of solvent moisture level have no significant effect on the performance of the lubricant films. We can ensure good tribological performance as long as we are able to precisely control the lubricant and X-1P thickness.</abstract><cop>New York, NY</cop><pub>IEEE</pub><doi>10.1109/TMAG.2002.802837</doi><tpages>3</tpages></addata></record> |
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| subjects | Applied sciences Bonding Cascading style sheets Conductive films Contact angle Electronics Exact sciences and technology Goniometers Lubricants Lubricants & lubrication Lubrication Magnetic and optical mass memories Magnetism Moisture Other magnetic recording and storage devices (including tapes, disks, and drums) Solvents Storage and reproduction of information Testing Thickness control |
| title | Lubrication process solvent moisture study |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-25T06%3A51%3A19IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_RIE&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Lubrication%20process%20solvent%20moisture%20study&rft.jtitle=IEEE%20transactions%20on%20magnetics&rft.au=Chen,%20S.H.&rft.date=2002-09-01&rft.volume=38&rft.issue=5&rft.spage=2114&rft.epage=2116&rft.pages=2114-2116&rft.issn=0018-9464&rft.eissn=1941-0069&rft.coden=IEMGAQ&rft_id=info:doi/10.1109/TMAG.2002.802837&rft_dat=%3Cproquest_RIE%3E28339796%3C/proquest_RIE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=884514678&rft_id=info:pmid/&rft_ieee_id=1042108&rfr_iscdi=true |