A glass/silicon technology for low-power robust gas sensors
Semiconductor gas sensors are devices based on metallic oxides that operate at high temperatures for achieving good sensitivities to the gases of interest. Silicon micromachined structures are often used as platforms for obtaining both high temperatures and low-power consumption at the same time. In...
Gespeichert in:
Veröffentlicht in: | IEEE sensors journal 2004-04, Vol.4 (2), p.195-206 |
---|---|
Hauptverfasser: | , , , , , , , |
Format: | Artikel |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | 206 |
---|---|
container_issue | 2 |
container_start_page | 195 |
container_title | IEEE sensors journal |
container_volume | 4 |
creator | Plaza, J.A. Lopez-Bosque, M.J. Gracia, I. Cane, C. Wollenstein, J. Kuhner, G. Plescher, G. Bottner, H. |
description | Semiconductor gas sensors are devices based on metallic oxides that operate at high temperatures for achieving good sensitivities to the gases of interest. Silicon micromachined structures are often used as platforms for obtaining both high temperatures and low-power consumption at the same time. In this paper, a microstructure based on the combination of micromachined silicon substrates and glass wafers is presented. The device incorporates an array of four different thin-film gas sensors that, depending on the design, can operate at the same or at different temperatures. The designs have been optimized by the finite element method (FEM) and the geometrical parameters of the structure have been selected in order to reduce the power consumption. The full process fabrication is presented. It is based on the combination of bulk micromachining, glass structuring, anodic bonding, and sensitive material deposition. Electrical, thermal, and mechanical tests have been done to demonstrate that the devices show high robustness and can reach high temperatures with low-power consumption. |
doi_str_mv | 10.1109/JSEN.2004.823681 |
format | Article |
fullrecord | <record><control><sourceid>proquest_RIE</sourceid><recordid>TN_cdi_proquest_miscellaneous_28323614</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>1271267</ieee_id><sourcerecordid>901717401</sourcerecordid><originalsourceid>FETCH-LOGICAL-c351t-255184a5337c65278744c415750371eeadfcaf0e39b674d2001db86de37dd3653</originalsourceid><addsrcrecordid>eNp9kM1LwzAYxoMoOKd3wUvxoKduefPRpHiSMb8YelDBW8jSdHZ0zUxaxv57UyoIHjy97-H3PPD8EDoHPAHA-fTpdf48IRiziSQ0k3CARsC5TEEwedj_FKeMio9jdBLCGmPIBRcjdHObrGodwjRUdWVck7TWfDaudqt9Ujqf1G6Xbt3O-sS7ZRfaZKVDEmwTnA-n6KjUdbBnP3eM3u_mb7OHdPFy_zi7XaSGcmhTwjlIpjmlwmScCCkYMwy44JgKsFYXpdEltjRfZoIVcQMUS5kVloqioBmnY3Q99G69--psaNWmCsbWtW6s64LKMYg4E0Mkr_4liaRRDrAIXv4B167zTVyhpKQCcyZIhPAAGe9C8LZUW19ttN8rwKqXrnrpqpeuBukxcjFEKmvtL04EkEzQb8EYe4M</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>883705472</pqid></control><display><type>article</type><title>A glass/silicon technology for low-power robust gas sensors</title><source>IEEE</source><creator>Plaza, J.A. ; Lopez-Bosque, M.J. ; Gracia, I. ; Cane, C. ; Wollenstein, J. ; Kuhner, G. ; Plescher, G. ; Bottner, H.</creator><creatorcontrib>Plaza, J.A. ; Lopez-Bosque, M.J. ; Gracia, I. ; Cane, C. ; Wollenstein, J. ; Kuhner, G. ; Plescher, G. ; Bottner, H.</creatorcontrib><description>Semiconductor gas sensors are devices based on metallic oxides that operate at high temperatures for achieving good sensitivities to the gases of interest. Silicon micromachined structures are often used as platforms for obtaining both high temperatures and low-power consumption at the same time. In this paper, a microstructure based on the combination of micromachined silicon substrates and glass wafers is presented. The device incorporates an array of four different thin-film gas sensors that, depending on the design, can operate at the same or at different temperatures. The designs have been optimized by the finite element method (FEM) and the geometrical parameters of the structure have been selected in order to reduce the power consumption. The full process fabrication is presented. It is based on the combination of bulk micromachining, glass structuring, anodic bonding, and sensitive material deposition. Electrical, thermal, and mechanical tests have been done to demonstrate that the devices show high robustness and can reach high temperatures with low-power consumption.</description><identifier>ISSN: 1530-437X</identifier><identifier>EISSN: 1558-1748</identifier><identifier>DOI: 10.1109/JSEN.2004.823681</identifier><identifier>CODEN: ISJEAZ</identifier><language>eng</language><publisher>New York: IEEE</publisher><subject>Devices ; Finite element analysis ; Finite element method ; Gas detectors ; Gas sensors ; Gases ; Glass ; Mathematical models ; Micromachining ; Micromechanics ; Microstructure ; Robustness ; Semiconductors ; Sensor arrays ; Sensors ; Silicon ; Substrates ; Temperature sensors ; Thin film devices</subject><ispartof>IEEE sensors journal, 2004-04, Vol.4 (2), p.195-206</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2004</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c351t-255184a5337c65278744c415750371eeadfcaf0e39b674d2001db86de37dd3653</citedby><cites>FETCH-LOGICAL-c351t-255184a5337c65278744c415750371eeadfcaf0e39b674d2001db86de37dd3653</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/1271267$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,776,780,792,27901,27902,54733</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/1271267$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Plaza, J.A.</creatorcontrib><creatorcontrib>Lopez-Bosque, M.J.</creatorcontrib><creatorcontrib>Gracia, I.</creatorcontrib><creatorcontrib>Cane, C.</creatorcontrib><creatorcontrib>Wollenstein, J.</creatorcontrib><creatorcontrib>Kuhner, G.</creatorcontrib><creatorcontrib>Plescher, G.</creatorcontrib><creatorcontrib>Bottner, H.</creatorcontrib><title>A glass/silicon technology for low-power robust gas sensors</title><title>IEEE sensors journal</title><addtitle>JSEN</addtitle><description>Semiconductor gas sensors are devices based on metallic oxides that operate at high temperatures for achieving good sensitivities to the gases of interest. Silicon micromachined structures are often used as platforms for obtaining both high temperatures and low-power consumption at the same time. In this paper, a microstructure based on the combination of micromachined silicon substrates and glass wafers is presented. The device incorporates an array of four different thin-film gas sensors that, depending on the design, can operate at the same or at different temperatures. The designs have been optimized by the finite element method (FEM) and the geometrical parameters of the structure have been selected in order to reduce the power consumption. The full process fabrication is presented. It is based on the combination of bulk micromachining, glass structuring, anodic bonding, and sensitive material deposition. Electrical, thermal, and mechanical tests have been done to demonstrate that the devices show high robustness and can reach high temperatures with low-power consumption.</description><subject>Devices</subject><subject>Finite element analysis</subject><subject>Finite element method</subject><subject>Gas detectors</subject><subject>Gas sensors</subject><subject>Gases</subject><subject>Glass</subject><subject>Mathematical models</subject><subject>Micromachining</subject><subject>Micromechanics</subject><subject>Microstructure</subject><subject>Robustness</subject><subject>Semiconductors</subject><subject>Sensor arrays</subject><subject>Sensors</subject><subject>Silicon</subject><subject>Substrates</subject><subject>Temperature sensors</subject><subject>Thin film devices</subject><issn>1530-437X</issn><issn>1558-1748</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2004</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNp9kM1LwzAYxoMoOKd3wUvxoKduefPRpHiSMb8YelDBW8jSdHZ0zUxaxv57UyoIHjy97-H3PPD8EDoHPAHA-fTpdf48IRiziSQ0k3CARsC5TEEwedj_FKeMio9jdBLCGmPIBRcjdHObrGodwjRUdWVck7TWfDaudqt9Ujqf1G6Xbt3O-sS7ZRfaZKVDEmwTnA-n6KjUdbBnP3eM3u_mb7OHdPFy_zi7XaSGcmhTwjlIpjmlwmScCCkYMwy44JgKsFYXpdEltjRfZoIVcQMUS5kVloqioBmnY3Q99G69--psaNWmCsbWtW6s64LKMYg4E0Mkr_4liaRRDrAIXv4B167zTVyhpKQCcyZIhPAAGe9C8LZUW19ttN8rwKqXrnrpqpeuBukxcjFEKmvtL04EkEzQb8EYe4M</recordid><startdate>20040401</startdate><enddate>20040401</enddate><creator>Plaza, J.A.</creator><creator>Lopez-Bosque, M.J.</creator><creator>Gracia, I.</creator><creator>Cane, C.</creator><creator>Wollenstein, J.</creator><creator>Kuhner, G.</creator><creator>Plescher, G.</creator><creator>Bottner, H.</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>7U5</scope><scope>8FD</scope><scope>L7M</scope><scope>F28</scope><scope>FR3</scope></search><sort><creationdate>20040401</creationdate><title>A glass/silicon technology for low-power robust gas sensors</title><author>Plaza, J.A. ; Lopez-Bosque, M.J. ; Gracia, I. ; Cane, C. ; Wollenstein, J. ; Kuhner, G. ; Plescher, G. ; Bottner, H.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c351t-255184a5337c65278744c415750371eeadfcaf0e39b674d2001db86de37dd3653</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2004</creationdate><topic>Devices</topic><topic>Finite element analysis</topic><topic>Finite element method</topic><topic>Gas detectors</topic><topic>Gas sensors</topic><topic>Gases</topic><topic>Glass</topic><topic>Mathematical models</topic><topic>Micromachining</topic><topic>Micromechanics</topic><topic>Microstructure</topic><topic>Robustness</topic><topic>Semiconductors</topic><topic>Sensor arrays</topic><topic>Sensors</topic><topic>Silicon</topic><topic>Substrates</topic><topic>Temperature sensors</topic><topic>Thin film devices</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Plaza, J.A.</creatorcontrib><creatorcontrib>Lopez-Bosque, M.J.</creatorcontrib><creatorcontrib>Gracia, I.</creatorcontrib><creatorcontrib>Cane, C.</creatorcontrib><creatorcontrib>Wollenstein, J.</creatorcontrib><creatorcontrib>Kuhner, G.</creatorcontrib><creatorcontrib>Plescher, G.</creatorcontrib><creatorcontrib>Bottner, H.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><jtitle>IEEE sensors journal</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Plaza, J.A.</au><au>Lopez-Bosque, M.J.</au><au>Gracia, I.</au><au>Cane, C.</au><au>Wollenstein, J.</au><au>Kuhner, G.</au><au>Plescher, G.</au><au>Bottner, H.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>A glass/silicon technology for low-power robust gas sensors</atitle><jtitle>IEEE sensors journal</jtitle><stitle>JSEN</stitle><date>2004-04-01</date><risdate>2004</risdate><volume>4</volume><issue>2</issue><spage>195</spage><epage>206</epage><pages>195-206</pages><issn>1530-437X</issn><eissn>1558-1748</eissn><coden>ISJEAZ</coden><abstract>Semiconductor gas sensors are devices based on metallic oxides that operate at high temperatures for achieving good sensitivities to the gases of interest. Silicon micromachined structures are often used as platforms for obtaining both high temperatures and low-power consumption at the same time. In this paper, a microstructure based on the combination of micromachined silicon substrates and glass wafers is presented. The device incorporates an array of four different thin-film gas sensors that, depending on the design, can operate at the same or at different temperatures. The designs have been optimized by the finite element method (FEM) and the geometrical parameters of the structure have been selected in order to reduce the power consumption. The full process fabrication is presented. It is based on the combination of bulk micromachining, glass structuring, anodic bonding, and sensitive material deposition. Electrical, thermal, and mechanical tests have been done to demonstrate that the devices show high robustness and can reach high temperatures with low-power consumption.</abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/JSEN.2004.823681</doi><tpages>12</tpages></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | ISSN: 1530-437X |
ispartof | IEEE sensors journal, 2004-04, Vol.4 (2), p.195-206 |
issn | 1530-437X 1558-1748 |
language | eng |
recordid | cdi_proquest_miscellaneous_28323614 |
source | IEEE |
subjects | Devices Finite element analysis Finite element method Gas detectors Gas sensors Gases Glass Mathematical models Micromachining Micromechanics Microstructure Robustness Semiconductors Sensor arrays Sensors Silicon Substrates Temperature sensors Thin film devices |
title | A glass/silicon technology for low-power robust gas sensors |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-14T13%3A31%3A53IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_RIE&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=A%20glass/silicon%20technology%20for%20low-power%20robust%20gas%20sensors&rft.jtitle=IEEE%20sensors%20journal&rft.au=Plaza,%20J.A.&rft.date=2004-04-01&rft.volume=4&rft.issue=2&rft.spage=195&rft.epage=206&rft.pages=195-206&rft.issn=1530-437X&rft.eissn=1558-1748&rft.coden=ISJEAZ&rft_id=info:doi/10.1109/JSEN.2004.823681&rft_dat=%3Cproquest_RIE%3E901717401%3C/proquest_RIE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=883705472&rft_id=info:pmid/&rft_ieee_id=1271267&rfr_iscdi=true |