Phase-field simulations of solidification of Al-Cu binary alloys
The dendrite growth process during the solidification of the Al-4.5%Cu binary alloy was simulated using the phase-field model, proposed by Kim et al. Solute diffusion equation and heat transfer equation were solved simultaneously. The effects of the noise on the dendrite growth, solute and temperatu...
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Veröffentlicht in: | Transactions of Nonferrous Metals Society of China 2004-04, Vol.14 (2), p.291-296 |
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description | The dendrite growth process during the solidification of the Al-4.5%Cu binary alloy was simulated using the phase-field model, proposed by Kim et al. Solute diffusion equation and heat transfer equation were solved simultaneously. The effects of the noise on the dendrite growth, solute and temperature profile in the undercooled alloy melt were investigated. The results indicate that the noise can trigger the growth of the secondary arms, and increase the highest temperature and solute concentration, but not influence the tip operating state. The solute and temperature gradients in the tip are the highest. |
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fullrecord | <record><control><sourceid>proquest_chong</sourceid><recordid>TN_cdi_proquest_miscellaneous_28301739</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><cqvip_id>9746857</cqvip_id><sourcerecordid>28301739</sourcerecordid><originalsourceid>FETCH-LOGICAL-c210t-ad8c5c15559e78d444aac0758f77adc1b58112a3beaf6abf565ab81104cd3b263</originalsourceid><addsrcrecordid>eNotzLlOAzEUhWEXIBEC7zA0dJbs8TodUcQmRYIC6tH1lhicMcmdKfL2BJLqSJ9-nQsy44wJqkWrr8g14hdjUmrNZ-ThfQMYacqxhAbzdiow5jpgU1ODteSQU_b_9CeLQpdT4_IA-0MDpdQD3pDLBAXj7Xnn5PPp8WP5Qldvz6_LxYr6lrORQrBeea6U6qKxQUoJ4JlRNhkDwXOnLOctCBchaXBJaQXuSEz6IFyrxZzcn35_9nU3RRz7bUYfS4Eh1gn71grGjeiO4d0p9Js6rHd5WPcO_HfKJfadkdoqI34Bs3ZRWA</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>28301739</pqid></control><display><type>article</type><title>Phase-field simulations of solidification of Al-Cu binary alloys</title><source>Alma/SFX Local Collection</source><creator>龙文元 蔡启舟 陈立亮 魏伯康</creator><creatorcontrib>龙文元 蔡启舟 陈立亮 魏伯康</creatorcontrib><description>The dendrite growth process during the solidification of the Al-4.5%Cu binary alloy was simulated using the phase-field model, proposed by Kim et al. Solute diffusion equation and heat transfer equation were solved simultaneously. The effects of the noise on the dendrite growth, solute and temperature profile in the undercooled alloy melt were investigated. The results indicate that the noise can trigger the growth of the secondary arms, and increase the highest temperature and solute concentration, but not influence the tip operating state. The solute and temperature gradients in the tip are the highest.</description><identifier>ISSN: 1003-6326</identifier><language>eng</language><subject>Al-Cu合金 ; 二元合金 ; 数值模拟 ; 温度场 ; 铝合金</subject><ispartof>Transactions of Nonferrous Metals Society of China, 2004-04, Vol.14 (2), p.291-296</ispartof><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Uhttp://image.cqvip.com/vip1000/qk/85276X/85276X.jpg</thumbnail><link.rule.ids>314,776,780</link.rule.ids></links><search><creatorcontrib>龙文元 蔡启舟 陈立亮 魏伯康</creatorcontrib><title>Phase-field simulations of solidification of Al-Cu binary alloys</title><title>Transactions of Nonferrous Metals Society of China</title><addtitle>Transactions of Nonferrous Metals Society of China</addtitle><description>The dendrite growth process during the solidification of the Al-4.5%Cu binary alloy was simulated using the phase-field model, proposed by Kim et al. Solute diffusion equation and heat transfer equation were solved simultaneously. The effects of the noise on the dendrite growth, solute and temperature profile in the undercooled alloy melt were investigated. The results indicate that the noise can trigger the growth of the secondary arms, and increase the highest temperature and solute concentration, but not influence the tip operating state. The solute and temperature gradients in the tip are the highest.</description><subject>Al-Cu合金</subject><subject>二元合金</subject><subject>数值模拟</subject><subject>温度场</subject><subject>铝合金</subject><issn>1003-6326</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2004</creationdate><recordtype>article</recordtype><recordid>eNotzLlOAzEUhWEXIBEC7zA0dJbs8TodUcQmRYIC6tH1lhicMcmdKfL2BJLqSJ9-nQsy44wJqkWrr8g14hdjUmrNZ-ThfQMYacqxhAbzdiow5jpgU1ODteSQU_b_9CeLQpdT4_IA-0MDpdQD3pDLBAXj7Xnn5PPp8WP5Qldvz6_LxYr6lrORQrBeea6U6qKxQUoJ4JlRNhkDwXOnLOctCBchaXBJaQXuSEz6IFyrxZzcn35_9nU3RRz7bUYfS4Eh1gn71grGjeiO4d0p9Js6rHd5WPcO_HfKJfadkdoqI34Bs3ZRWA</recordid><startdate>20040401</startdate><enddate>20040401</enddate><creator>龙文元 蔡启舟 陈立亮 魏伯康</creator><scope>2RA</scope><scope>92L</scope><scope>CQIGP</scope><scope>W92</scope><scope>~WA</scope><scope>7QF</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope></search><sort><creationdate>20040401</creationdate><title>Phase-field simulations of solidification of Al-Cu binary alloys</title><author>龙文元 蔡启舟 陈立亮 魏伯康</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c210t-ad8c5c15559e78d444aac0758f77adc1b58112a3beaf6abf565ab81104cd3b263</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2004</creationdate><topic>Al-Cu合金</topic><topic>二元合金</topic><topic>数值模拟</topic><topic>温度场</topic><topic>铝合金</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>龙文元 蔡启舟 陈立亮 魏伯康</creatorcontrib><collection>中文科技期刊数据库</collection><collection>中文科技期刊数据库-CALIS站点</collection><collection>中文科技期刊数据库-7.0平台</collection><collection>中文科技期刊数据库-工程技术</collection><collection>中文科技期刊数据库- 镜像站点</collection><collection>Aluminium Industry Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Transactions of Nonferrous Metals Society of China</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>龙文元 蔡启舟 陈立亮 魏伯康</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Phase-field simulations of solidification of Al-Cu binary alloys</atitle><jtitle>Transactions of Nonferrous Metals Society of China</jtitle><addtitle>Transactions of Nonferrous Metals Society of China</addtitle><date>2004-04-01</date><risdate>2004</risdate><volume>14</volume><issue>2</issue><spage>291</spage><epage>296</epage><pages>291-296</pages><issn>1003-6326</issn><abstract>The dendrite growth process during the solidification of the Al-4.5%Cu binary alloy was simulated using the phase-field model, proposed by Kim et al. Solute diffusion equation and heat transfer equation were solved simultaneously. The effects of the noise on the dendrite growth, solute and temperature profile in the undercooled alloy melt were investigated. The results indicate that the noise can trigger the growth of the secondary arms, and increase the highest temperature and solute concentration, but not influence the tip operating state. The solute and temperature gradients in the tip are the highest.</abstract><tpages>6</tpages></addata></record> |
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subjects | Al-Cu合金 二元合金 数值模拟 温度场 铝合金 |
title | Phase-field simulations of solidification of Al-Cu binary alloys |
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