Non-destructive damage sensing and cure monitoring of carbon fiber/epoxyacrylate composites with UV and thermal curing using electro-micromechanical techniques

Interfacial properties and cure monitoring of single-carbon fiber/thermosetting composites by thermal and different ultraviolet (UV) curing processes were investigated using electro-micromechanical test and electrical resistance measurement. During curing process the residual stress was monitored in terms of the electrical resistance and then they were compared to various curing conditions. In thermal cure the tensile strength and modulus of epoxyacrylate matrix were higher than those of UV cure, whereas the failure strain was lower. Interfacial shear strength (IFSS) increased gradually with elapsing UV exposing time and then saturated. For thermal cure the IFSS was significantly higher than that of UV cure, and cure shrinkage was observed due to matrix shrinkage and residual stress due to the difference in thermal expansion coefficient (TEC). The difference in electrical resistance, Δ R during thermal curing was larger than that of UV cure. In thermal cure apparent modulus indicating embedding matrix modulus and interfacial adhesion was highest and reaching time up to same stress was shortest. Thermal cure showed the strong durability against the IFSS deterioration after boiling test compared to UV cure.