Deflection and maximum load of microfiltration membrane sieves made with silicon micromachining

With the use of silicon micromachining, an inorganic membrane sieve for microfiltration has been constructed having a silicon nitride membrane layer with thickness typically 1 /spl mu/m and perforations typically between 0.5 /spl mu/m and 10 /spl mu/m in diameter. As a support a -silicon wafer with...

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Veröffentlicht in:Journal of microelectromechanical systems 1997-03, Vol.6 (1), p.48-54
Hauptverfasser: van Rijn, C., van der Wekken, M., Nijdam, W., Elwenspoek, M.
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container_issue 1
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container_title Journal of microelectromechanical systems
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creator van Rijn, C.
van der Wekken, M.
Nijdam, W.
Elwenspoek, M.
description With the use of silicon micromachining, an inorganic membrane sieve for microfiltration has been constructed having a silicon nitride membrane layer with thickness typically 1 /spl mu/m and perforations typically between 0.5 /spl mu/m and 10 /spl mu/m in diameter. As a support a -silicon wafer with openings of 1000 /spl mu/m in diameter has been used. The thin silicon nitride layer is deposited on an initially dense support by means of a suitable chemical vapor deposition method (LPCVD). Perforations in the membrane layer are obtained with use of standard photo lithography and reactive ion etching (RIE). The deflection and maximum load of the membrane sieves are calculated in a first approximation. Experiments to measure the maximum load of silicon-rich silicon nitride membranes have confirmed this approximation.
doi_str_mv 10.1109/84.557530
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1941-0158
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subjects Biomembranes
Chemical vapor deposition
Chemistry
Colloidal state and disperse state
Exact sciences and technology
Filters
Filtration
General and physical chemistry
Lacquers
Lithography
Membranes
Microfiltration
Micromachining
Silicon
Temperature
title Deflection and maximum load of microfiltration membrane sieves made with silicon micromachining
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