Underwater and water-assisted laser processing: Part 2—Etching, cutting and rarely used methods

In the second part of the article, the subtractive processes—laser etching and cutting—in the presence of liquid water will be reviewed; but the rarely used methods of water assisted/underwater laser processing, such as welding, silicon wafer breaking, surface modification of polymers, pulsed laser...

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Veröffentlicht in:	Optics and lasers in engineering 2004-02, Vol.41 (2), p.329-352
1. Verfasser:	Kruusing, Arvi
Format:	Artikel
Sprache:	eng
Schlagworte:	Biological and medical applications Chemical surface modification Exact sciences and technology Fundamental areas of phenomenology (including applications) Industrial applications Laser machining Laser welding Optics Particle formation Physics Pulsed laser deposition PZT platelets Review Water
Online-Zugang:	Volltext
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