Microstructure and Mechanical Properties of DBC on Sputter Deposited Copper on Alumina Substrate

The process of Direct Bonding Copper (DBC) is performed by a spinel reaction between CuO and Al2O3. In order to develop DBC on alumina substrate with high bonding strength, alumina substrate was preformed as follows: Cu was sputter-deposited on alumina substrate. Sputter-Deposited Cu (SDC) on alumin...

Ausführliche Beschreibung

Bibliographische Detailangaben

Veröffentlicht in:	Materials science forum 2004-01, Vol.449-452, p.677-680
Hauptverfasser:	Cho, Dong Choul, Lee, Chung Hyo, Lee, Chang Hee, Lee, Young Sup
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!