Material and design considerations of FBGA reliability performance

FBGA package reliability is usually assessed through the conventional approaches of die attach and mold compound material optimization. However, with the rapid changes and fast-moving pace of electronic packaging and the introduction of new soldermask and core materials, substrate design has also be...

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Veröffentlicht in:	Thin solid films 2004-09, Vol.462 (Complete), p.465-470
Hauptverfasser:	Lee, Teck Kheng, Ng, Teng Chye, Chai, Yih Ming
Format:	Artikel
Sprache:	eng
Schlagworte:	Interposer materials Package reliability Soldermask
Online-Zugang:	Volltext
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