The effect of water diffusion on the adhesion of organosilicate glass film stacks

Organosilicate glass (OSG) is a material that is used as a dielectric in advanced integrated circuits. It has a network structure similar to that of amorphous silica where a fraction of the Si–O bonds have been replaced by organic groups. It is well known from prior work that OSG is sensitive to sub...

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Veröffentlicht in:	Journal of the mechanics and physics of solids 2006-05, Vol.54 (5), p.887-903
Hauptverfasser:	Tsui, Ting Y., McKerrow, Andrew J., Vlassak, Joost J.
Format:	Artikel
Sprache:	eng
Schlagworte:	Adhesion Fracture Layered material Organosilicate glass material Water diffusion
Online-Zugang:	Volltext
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