Performance comparison between carbon nanotube and copper interconnects for gigascale integration (GSI)
Physical models are used to determine the ultimate potential performance of carbon nanotube interconnects and compare them with minimum-size copper wires implemented at various technology generations. Results offer important guidance regarding the nature of carbon nanotube technology development nee...
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| Veröffentlicht in: | IEEE electron device letters 2005-02, Vol.26 (2), p.84-86 |
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| container_end_page | 86 |
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| container_title | IEEE electron device letters |
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| creator | Naeemi, A. Sarvari, R. Meindl, J.D. |
| description | Physical models are used to determine the ultimate potential performance of carbon nanotube interconnects and compare them with minimum-size copper wires implemented at various technology generations. Results offer important guidance regarding the nature of carbon nanotube technology development needed for improving interconnect performance. Since wave propagation is slow in a single nanotube, nanotube bundles with larger wave speeds must be used. At the 45-nm node (year 2010), the performance enhancement that can be achieved by using nanotube bundles is negligible, and at the 22-nm node (year 2016) it can be as large as 80%. |
| doi_str_mv | 10.1109/LED.2004.841440 |
| format | Article |
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Results offer important guidance regarding the nature of carbon nanotube technology development needed for improving interconnect performance. Since wave propagation is slow in a single nanotube, nanotube bundles with larger wave speeds must be used. At the 45-nm node (year 2010), the performance enhancement that can be achieved by using nanotube bundles is negligible, and at the 22-nm node (year 2016) it can be as large as 80%.</description><subject>Applied sciences</subject><subject>Bundles</subject><subject>CARBON BASE MATERIALS</subject><subject>Carbon nanotubes</subject><subject>COMPOSITES</subject><subject>CONNECTORS (ELECTRICAL)</subject><subject>Copper</subject><subject>Design. Technologies. Operation analysis. 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| identifier | ISSN: 0741-3106 |
| ispartof | IEEE electron device letters, 2005-02, Vol.26 (2), p.84-86 |
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| source | IEEE Electronic Library (IEL) |
| subjects | Applied sciences Bundles CARBON BASE MATERIALS Carbon nanotubes COMPOSITES CONNECTORS (ELECTRICAL) Copper Design. Technologies. Operation analysis. Testing Electronics Electrons Electrostatics Exact sciences and technology Inductance Integrated circuit interconnections Integrated circuits Interconnections kinetic inductance Kinetic theory MICROSTRUCTURES modeling molecular electronics Nanocomposites Nanomaterials Nanostructure Particle scattering Performance enhancement Quantum capacitance quantum wires Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices TUBE Wave propagation Wires |
| title | Performance comparison between carbon nanotube and copper interconnects for gigascale integration (GSI) |
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