Ductile-to-brittle transition in Sn–Zn solder joints measured by impact test
Sn–9Zn and Sn–8Zn–3Bi solder balls were bonded to Cu or electroless Au/Ni(P) pads, and the effect of aging on impact reliability was investigated. A test similar to the classic Charpy impact test was performed to measure the impact toughness of the solder joints. In the case of the solder/Cu joints,...
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| Veröffentlicht in: | Scripta materialia 2004-10, Vol.51 (7), p.641-645 |
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| creator | Date, M. Shoji, T. Fujiyoshi, M. Sato, K. Tu, K.N. |
| description | Sn–9Zn and Sn–8Zn–3Bi solder balls were bonded to Cu or electroless Au/Ni(P) pads, and the effect of aging on impact reliability was investigated. A test similar to the classic Charpy impact test was performed to measure the impact toughness of the solder joints. In the case of the solder/Cu joints, γ-Cu
5Zn
8 at the bond interface thickened remarkably with the aging time, accompanied by void formation, resulting in a ductile-to-brittle transition of the joint. In the case of the solder/Au/Ni(P) joints, however, the slow dissolution and diffusion of Ni into the solders as well as the redeposition of Zn at the interface contributed to maintaining high impact toughness even after a prolonged aging. All of the bumps on the Au/Ni(P) broke in a ductile manner. |
| doi_str_mv | 10.1016/j.scriptamat.2004.06.027 |
| format | Article |
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5Zn
8 at the bond interface thickened remarkably with the aging time, accompanied by void formation, resulting in a ductile-to-brittle transition of the joint. In the case of the solder/Au/Ni(P) joints, however, the slow dissolution and diffusion of Ni into the solders as well as the redeposition of Zn at the interface contributed to maintaining high impact toughness even after a prolonged aging. All of the bumps on the Au/Ni(P) broke in a ductile manner.</description><identifier>ISSN: 1359-6462</identifier><identifier>EISSN: 1872-8456</identifier><identifier>DOI: 10.1016/j.scriptamat.2004.06.027</identifier><language>eng</language><publisher>New York, NY: Elsevier Ltd</publisher><subject>Applied sciences ; Au–Zn intermetallic compound ; Cu–Zn intermetallic compound ; Ductile-to-brittle transition ; Exact sciences and technology ; Fractures ; Impact test ; Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology ; Metals. Metallurgy ; Sn–Zn solder</subject><ispartof>Scripta materialia, 2004-10, Vol.51 (7), p.641-645</ispartof><rights>2004 Acta Materialia Inc</rights><rights>2004 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c443t-2261579be5ede28c64f6b1a001b34681e3353ad18f327965c0ac8869cd8c166c3</citedby><cites>FETCH-LOGICAL-c443t-2261579be5ede28c64f6b1a001b34681e3353ad18f327965c0ac8869cd8c166c3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://dx.doi.org/10.1016/j.scriptamat.2004.06.027$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,780,784,3550,27924,27925,45995</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=15975756$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Date, M.</creatorcontrib><creatorcontrib>Shoji, T.</creatorcontrib><creatorcontrib>Fujiyoshi, M.</creatorcontrib><creatorcontrib>Sato, K.</creatorcontrib><creatorcontrib>Tu, K.N.</creatorcontrib><title>Ductile-to-brittle transition in Sn–Zn solder joints measured by impact test</title><title>Scripta materialia</title><description>Sn–9Zn and Sn–8Zn–3Bi solder balls were bonded to Cu or electroless Au/Ni(P) pads, and the effect of aging on impact reliability was investigated. A test similar to the classic Charpy impact test was performed to measure the impact toughness of the solder joints. In the case of the solder/Cu joints, γ-Cu
5Zn
8 at the bond interface thickened remarkably with the aging time, accompanied by void formation, resulting in a ductile-to-brittle transition of the joint. In the case of the solder/Au/Ni(P) joints, however, the slow dissolution and diffusion of Ni into the solders as well as the redeposition of Zn at the interface contributed to maintaining high impact toughness even after a prolonged aging. All of the bumps on the Au/Ni(P) broke in a ductile manner.</description><subject>Applied sciences</subject><subject>Au–Zn intermetallic compound</subject><subject>Cu–Zn intermetallic compound</subject><subject>Ductile-to-brittle transition</subject><subject>Exact sciences and technology</subject><subject>Fractures</subject><subject>Impact test</subject><subject>Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology</subject><subject>Metals. Metallurgy</subject><subject>Sn–Zn solder</subject><issn>1359-6462</issn><issn>1872-8456</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2004</creationdate><recordtype>article</recordtype><recordid>eNqFkLtOxDAQRSMEEsvCP7iBLsF2bMcpYXlKKyiAhsZynInkKC9sB2k7_oE_5Esw2pW2pJopzp2rOUmCCM4IJuKyzbxxdgq61yGjGLMMiwzT4iBZEFnQVDIuDuOe8zIVTNDj5MT7FmMsCCWL5OlmNsF2kIYxrZwNoQMUnB68DXYckB3Qy_Dz9f0-ID92NTjUjnYIHvWg_eygRtUG2X7SJqAAPpwmR43uPJzt5jJ5u7t9XT2k6-f7x9XVOjWM5SGlVBBelBVwqIFKI1gjKqIxJlXOhCSQ5zzXNZFNTotScIO1kVKUppaGCGHyZXKxvTu58WOOxaq33kDX6QHG2SsqCeOsxBGUW9C40XsHjZqc7bXbKILVn0DVqr1A9SdQYaGiwBg933Vob3TXRCvG-n2elwUvuIjc9ZaD-PCnBRcPWhgM1NaBCaoe7f9lv3yCjQk</recordid><startdate>20041001</startdate><enddate>20041001</enddate><creator>Date, M.</creator><creator>Shoji, T.</creator><creator>Fujiyoshi, M.</creator><creator>Sato, K.</creator><creator>Tu, K.N.</creator><general>Elsevier Ltd</general><general>Elsevier Science</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7TB</scope><scope>7U5</scope><scope>8BQ</scope><scope>8FD</scope><scope>FR3</scope><scope>H8D</scope><scope>H8G</scope><scope>JG9</scope><scope>KR7</scope><scope>L7M</scope></search><sort><creationdate>20041001</creationdate><title>Ductile-to-brittle transition in Sn–Zn solder joints measured by impact test</title><author>Date, M. ; Shoji, T. ; Fujiyoshi, M. ; Sato, K. ; Tu, K.N.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c443t-2261579be5ede28c64f6b1a001b34681e3353ad18f327965c0ac8869cd8c166c3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2004</creationdate><topic>Applied sciences</topic><topic>Au–Zn intermetallic compound</topic><topic>Cu–Zn intermetallic compound</topic><topic>Ductile-to-brittle transition</topic><topic>Exact sciences and technology</topic><topic>Fractures</topic><topic>Impact test</topic><topic>Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology</topic><topic>Metals. Metallurgy</topic><topic>Sn–Zn solder</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Date, M.</creatorcontrib><creatorcontrib>Shoji, T.</creatorcontrib><creatorcontrib>Fujiyoshi, M.</creatorcontrib><creatorcontrib>Sato, K.</creatorcontrib><creatorcontrib>Tu, K.N.</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Engineering Research Database</collection><collection>Aerospace Database</collection><collection>Copper Technical Reference Library</collection><collection>Materials Research Database</collection><collection>Civil Engineering Abstracts</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Scripta materialia</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Date, M.</au><au>Shoji, T.</au><au>Fujiyoshi, M.</au><au>Sato, K.</au><au>Tu, K.N.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Ductile-to-brittle transition in Sn–Zn solder joints measured by impact test</atitle><jtitle>Scripta materialia</jtitle><date>2004-10-01</date><risdate>2004</risdate><volume>51</volume><issue>7</issue><spage>641</spage><epage>645</epage><pages>641-645</pages><issn>1359-6462</issn><eissn>1872-8456</eissn><abstract>Sn–9Zn and Sn–8Zn–3Bi solder balls were bonded to Cu or electroless Au/Ni(P) pads, and the effect of aging on impact reliability was investigated. A test similar to the classic Charpy impact test was performed to measure the impact toughness of the solder joints. In the case of the solder/Cu joints, γ-Cu
5Zn
8 at the bond interface thickened remarkably with the aging time, accompanied by void formation, resulting in a ductile-to-brittle transition of the joint. In the case of the solder/Au/Ni(P) joints, however, the slow dissolution and diffusion of Ni into the solders as well as the redeposition of Zn at the interface contributed to maintaining high impact toughness even after a prolonged aging. All of the bumps on the Au/Ni(P) broke in a ductile manner.</abstract><cop>New York, NY</cop><pub>Elsevier Ltd</pub><doi>10.1016/j.scriptamat.2004.06.027</doi><tpages>5</tpages></addata></record> |
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| ispartof | Scripta materialia, 2004-10, Vol.51 (7), p.641-645 |
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| source | Elsevier ScienceDirect Journals Complete |
| subjects | Applied sciences Au–Zn intermetallic compound Cu–Zn intermetallic compound Ductile-to-brittle transition Exact sciences and technology Fractures Impact test Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology Metals. Metallurgy Sn–Zn solder |
| title | Ductile-to-brittle transition in Sn–Zn solder joints measured by impact test |
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