18 m electrodeposited copper foil for flex fatigue applications

The strain-based flex fatigue of 18 m thick copper foil is evaluated over a wide range of strain amplitudes. Seven electrodeposited foils, four commercial grades and three experimental foils, and a commercial grade rolled foil are characterized. The fatigue life versus cyclic strain amplitude curve...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Circuit world 1999-03, Vol.25 (1), p.38-46
Hauptverfasser: Merchant, Harish D., Minor, Melvin G., Clouser, Sid J., Leonard, Dan T.
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page 46
container_issue 1
container_start_page 38
container_title Circuit world
container_volume 25
creator Merchant, Harish D.
Minor, Melvin G.
Clouser, Sid J.
Leonard, Dan T.
description The strain-based flex fatigue of 18 m thick copper foil is evaluated over a wide range of strain amplitudes. Seven electrodeposited foils, four commercial grades and three experimental foils, and a commercial grade rolled foil are characterized. The fatigue life versus cyclic strain amplitude curve in the high strain amplitude (low cycle) and low strain amplitude (high cycle) regimes is developed for each foil. On the basis of fatigue life (Nf) and fatigue ductility (Df), the low cycle fatigue performance of eight foils is ranked. Universal correlations of Nf and Df with the uniaxial tensile strength are established. Two electrodeposited foils, experimental foil DF 8 in the high strain amplitude regime and commercial foil DF 9 in the low strain amplitude regime, have been shown to display fatigue performance comparable to that of the commercial rolled GR 8 foil.
doi_str_mv 10.1108/03056129910244842
format Article
fullrecord <record><control><sourceid>proquest_istex</sourceid><recordid>TN_cdi_proquest_miscellaneous_28129607</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>84987900</sourcerecordid><originalsourceid>FETCH-LOGICAL-e1747-8c1703d421b28234fc529dd6c1d6b14aec67649221051025de764c0b7740f7013</originalsourceid><addsrcrecordid>eNptkE1Lw0AQhhdRsFZ_gLfgwZPRmf3IJifR-gktelDsbUl3J5KaNjGbQP33bql4sF7mg3neYd5h7BjhHBHSCxCgEuRZhsClTCXfYQPUKo0T4NNdNljP4wDAPjvwfg4AQnEcsEtMo0VEFdmurR01tS87cpGtm4baqKjLKoRQVLSKirwr33uK8qapShuaeukP2V6RV56OfvKQvd7dvowe4vHT_ePoahwTaqnj1KIG4STHGU-5kIVVPHMuseiSGcqcbKITmXGOoIID5Si0FmZaSyg0oBiy083epq0_e_KdWZTeUlXlS6p7b3gazCegA3jyB5zXfbsMtxmOmRI80SJA8QYqfUcr07TlIm-_TN5-mDDWysg3bibT62vxPNHmJvCw4WlBbV65XwWCWb_fbL0_SM7-l2yhpnGF-AaoeoEA</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>219532673</pqid></control><display><type>article</type><title>18 m electrodeposited copper foil for flex fatigue applications</title><source>Emerald Journals</source><creator>Merchant, Harish D. ; Minor, Melvin G. ; Clouser, Sid J. ; Leonard, Dan T.</creator><creatorcontrib>Merchant, Harish D. ; Minor, Melvin G. ; Clouser, Sid J. ; Leonard, Dan T.</creatorcontrib><description>The strain-based flex fatigue of 18 m thick copper foil is evaluated over a wide range of strain amplitudes. Seven electrodeposited foils, four commercial grades and three experimental foils, and a commercial grade rolled foil are characterized. The fatigue life versus cyclic strain amplitude curve in the high strain amplitude (low cycle) and low strain amplitude (high cycle) regimes is developed for each foil. On the basis of fatigue life (Nf) and fatigue ductility (Df), the low cycle fatigue performance of eight foils is ranked. Universal correlations of Nf and Df with the uniaxial tensile strength are established. Two electrodeposited foils, experimental foil DF 8 in the high strain amplitude regime and commercial foil DF 9 in the low strain amplitude regime, have been shown to display fatigue performance comparable to that of the commercial rolled GR 8 foil.</description><identifier>ISSN: 0305-6120</identifier><identifier>EISSN: 1758-602X</identifier><identifier>EISSN: 0305-6120</identifier><identifier>DOI: 10.1108/03056129910244842</identifier><identifier>CODEN: CIWODV</identifier><language>eng</language><publisher>Bradford: MCB UP Ltd</publisher><subject>Anisotropy ; Annealing ; Circuits ; Copper ; Ductility ; Fatigue ; Flexible circuit ; Strain ; Studies</subject><ispartof>Circuit world, 1999-03, Vol.25 (1), p.38-46</ispartof><rights>MCB UP Limited</rights><rights>Copyright MCB UP Limited (MCB) 1999</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://www.emerald.com/insight/content/doi/10.1108/03056129910244842/full/pdf$$EPDF$$P50$$Gemerald$$H</linktopdf><linktohtml>$$Uhttps://www.emerald.com/insight/content/doi/10.1108/03056129910244842/full/html$$EHTML$$P50$$Gemerald$$H</linktohtml><link.rule.ids>314,780,784,967,11635,27924,27925,52686,52689</link.rule.ids></links><search><creatorcontrib>Merchant, Harish D.</creatorcontrib><creatorcontrib>Minor, Melvin G.</creatorcontrib><creatorcontrib>Clouser, Sid J.</creatorcontrib><creatorcontrib>Leonard, Dan T.</creatorcontrib><title>18 m electrodeposited copper foil for flex fatigue applications</title><title>Circuit world</title><description>The strain-based flex fatigue of 18 m thick copper foil is evaluated over a wide range of strain amplitudes. Seven electrodeposited foils, four commercial grades and three experimental foils, and a commercial grade rolled foil are characterized. The fatigue life versus cyclic strain amplitude curve in the high strain amplitude (low cycle) and low strain amplitude (high cycle) regimes is developed for each foil. On the basis of fatigue life (Nf) and fatigue ductility (Df), the low cycle fatigue performance of eight foils is ranked. Universal correlations of Nf and Df with the uniaxial tensile strength are established. Two electrodeposited foils, experimental foil DF 8 in the high strain amplitude regime and commercial foil DF 9 in the low strain amplitude regime, have been shown to display fatigue performance comparable to that of the commercial rolled GR 8 foil.</description><subject>Anisotropy</subject><subject>Annealing</subject><subject>Circuits</subject><subject>Copper</subject><subject>Ductility</subject><subject>Fatigue</subject><subject>Flexible circuit</subject><subject>Strain</subject><subject>Studies</subject><issn>0305-6120</issn><issn>1758-602X</issn><issn>0305-6120</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>1999</creationdate><recordtype>article</recordtype><sourceid>AFKRA</sourceid><sourceid>AZQEC</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><sourceid>GNUQQ</sourceid><recordid>eNptkE1Lw0AQhhdRsFZ_gLfgwZPRmf3IJifR-gktelDsbUl3J5KaNjGbQP33bql4sF7mg3neYd5h7BjhHBHSCxCgEuRZhsClTCXfYQPUKo0T4NNdNljP4wDAPjvwfg4AQnEcsEtMo0VEFdmurR01tS87cpGtm4baqKjLKoRQVLSKirwr33uK8qapShuaeukP2V6RV56OfvKQvd7dvowe4vHT_ePoahwTaqnj1KIG4STHGU-5kIVVPHMuseiSGcqcbKITmXGOoIID5Si0FmZaSyg0oBiy083epq0_e_KdWZTeUlXlS6p7b3gazCegA3jyB5zXfbsMtxmOmRI80SJA8QYqfUcr07TlIm-_TN5-mDDWysg3bibT62vxPNHmJvCw4WlBbV65XwWCWb_fbL0_SM7-l2yhpnGF-AaoeoEA</recordid><startdate>19990301</startdate><enddate>19990301</enddate><creator>Merchant, Harish D.</creator><creator>Minor, Melvin G.</creator><creator>Clouser, Sid J.</creator><creator>Leonard, Dan T.</creator><general>MCB UP Ltd</general><general>Emerald Group Publishing Limited</general><scope>BSCLL</scope><scope>0U~</scope><scope>1-H</scope><scope>7SP</scope><scope>7TA</scope><scope>7WY</scope><scope>7WZ</scope><scope>7XB</scope><scope>8AO</scope><scope>8FD</scope><scope>8FE</scope><scope>8FG</scope><scope>AFKRA</scope><scope>ARAPS</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BEZIV</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>DWQXO</scope><scope>F28</scope><scope>FR3</scope><scope>F~G</scope><scope>GNUQQ</scope><scope>HCIFZ</scope><scope>JG9</scope><scope>K6~</scope><scope>L.-</scope><scope>L.0</scope><scope>L7M</scope><scope>M0C</scope><scope>M2P</scope><scope>P5Z</scope><scope>P62</scope><scope>PQBIZ</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>Q9U</scope><scope>S0W</scope><scope>8BQ</scope></search><sort><creationdate>19990301</creationdate><title>18 m electrodeposited copper foil for flex fatigue applications</title><author>Merchant, Harish D. ; Minor, Melvin G. ; Clouser, Sid J. ; Leonard, Dan T.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-e1747-8c1703d421b28234fc529dd6c1d6b14aec67649221051025de764c0b7740f7013</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>1999</creationdate><topic>Anisotropy</topic><topic>Annealing</topic><topic>Circuits</topic><topic>Copper</topic><topic>Ductility</topic><topic>Fatigue</topic><topic>Flexible circuit</topic><topic>Strain</topic><topic>Studies</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Merchant, Harish D.</creatorcontrib><creatorcontrib>Minor, Melvin G.</creatorcontrib><creatorcontrib>Clouser, Sid J.</creatorcontrib><creatorcontrib>Leonard, Dan T.</creatorcontrib><collection>Istex</collection><collection>Global News &amp; ABI/Inform Professional</collection><collection>Trade PRO</collection><collection>Electronics &amp; Communications Abstracts</collection><collection>Materials Business File</collection><collection>ABI/INFORM Collection</collection><collection>ABI/INFORM Global (PDF only)</collection><collection>ProQuest Central (purchase pre-March 2016)</collection><collection>ProQuest Pharma Collection</collection><collection>Technology Research Database</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>ProQuest Central UK/Ireland</collection><collection>Advanced Technologies &amp; Aerospace Database‎ (1962 - current)</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>ProQuest Business Premium Collection</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Central</collection><collection>ANTE: Abstracts in New Technology &amp; Engineering</collection><collection>Engineering Research Database</collection><collection>ABI/INFORM Global (Corporate)</collection><collection>ProQuest Central Student</collection><collection>SciTech Premium Collection</collection><collection>Materials Research Database</collection><collection>ProQuest Business Collection</collection><collection>ABI/INFORM Professional Advanced</collection><collection>ABI/INFORM Professional Standard</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>ABI/INFORM Global</collection><collection>Science Database (ProQuest)</collection><collection>ProQuest Advanced Technologies &amp; Aerospace Database</collection><collection>ProQuest Advanced Technologies &amp; Aerospace Collection</collection><collection>ProQuest One Business</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central Basic</collection><collection>DELNET Engineering &amp; Technology Collection</collection><collection>METADEX</collection><jtitle>Circuit world</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Merchant, Harish D.</au><au>Minor, Melvin G.</au><au>Clouser, Sid J.</au><au>Leonard, Dan T.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>18 m electrodeposited copper foil for flex fatigue applications</atitle><jtitle>Circuit world</jtitle><date>1999-03-01</date><risdate>1999</risdate><volume>25</volume><issue>1</issue><spage>38</spage><epage>46</epage><pages>38-46</pages><issn>0305-6120</issn><eissn>1758-602X</eissn><eissn>0305-6120</eissn><coden>CIWODV</coden><abstract>The strain-based flex fatigue of 18 m thick copper foil is evaluated over a wide range of strain amplitudes. Seven electrodeposited foils, four commercial grades and three experimental foils, and a commercial grade rolled foil are characterized. The fatigue life versus cyclic strain amplitude curve in the high strain amplitude (low cycle) and low strain amplitude (high cycle) regimes is developed for each foil. On the basis of fatigue life (Nf) and fatigue ductility (Df), the low cycle fatigue performance of eight foils is ranked. Universal correlations of Nf and Df with the uniaxial tensile strength are established. Two electrodeposited foils, experimental foil DF 8 in the high strain amplitude regime and commercial foil DF 9 in the low strain amplitude regime, have been shown to display fatigue performance comparable to that of the commercial rolled GR 8 foil.</abstract><cop>Bradford</cop><pub>MCB UP Ltd</pub><doi>10.1108/03056129910244842</doi><tpages>9</tpages></addata></record>
fulltext fulltext
identifier ISSN: 0305-6120
ispartof Circuit world, 1999-03, Vol.25 (1), p.38-46
issn 0305-6120
1758-602X
0305-6120
language eng
recordid cdi_proquest_miscellaneous_28129607
source Emerald Journals
subjects Anisotropy
Annealing
Circuits
Copper
Ductility
Fatigue
Flexible circuit
Strain
Studies
title 18 m electrodeposited copper foil for flex fatigue applications
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-07T17%3A32%3A51IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_istex&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=18%20m%20electrodeposited%20copper%20foil%20for%20flex%20fatigue%20applications&rft.jtitle=Circuit%20world&rft.au=Merchant,%20Harish%20D.&rft.date=1999-03-01&rft.volume=25&rft.issue=1&rft.spage=38&rft.epage=46&rft.pages=38-46&rft.issn=0305-6120&rft.eissn=1758-602X&rft.coden=CIWODV&rft_id=info:doi/10.1108/03056129910244842&rft_dat=%3Cproquest_istex%3E84987900%3C/proquest_istex%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=219532673&rft_id=info:pmid/&rfr_iscdi=true