Warpage prediction of optical media
The warpage of injection–compression‐molded optical media, such as compact discs and digital video discs, due to asymmetric cooling during production is predicted. Thermally induced stress is calculated with a nonisothermal compressible flow simulation with a viscoelastic constitutive model. A finit...
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| Veröffentlicht in: | Journal of polymer science. Part B, Polymer physics Polymer physics, 2003-05, Vol.41 (9), p.859-872 |
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| container_end_page | 872 |
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| container_issue | 9 |
| container_start_page | 859 |
| container_title | Journal of polymer science. Part B, Polymer physics |
| container_volume | 41 |
| creator | Fan, Bingfeng Kazmer, David O. Bushko, Wit C. Theriault, Richard P. Poslinski, Andrew J. |
| description | The warpage of injection–compression‐molded optical media, such as compact discs and digital video discs, due to asymmetric cooling during production is predicted. Thermally induced stress is calculated with a nonisothermal compressible flow simulation with a viscoelastic constitutive model. A finite element analysis is formulated with axisymmetric plate elements based on Kirchhoff thin‐plate theory to simulate the warpage of the disc due to the asymmetric thermal stress and gravity after demolding. Simulation results of warpage for compact‐disc‐recordable moldings are compared with experimental observations under different processing conditions, such as the melt temperature, mold temperature, and packing pressure, with an optical grade of polycarbonate. The comparison shows that the simulation well predicts the effects of various processing conditions. Both the simulation and experiment indicate that of the processing conditions, the mold temperature has the greatest effect on warpage. © 2003 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 41: 859–872, 2003 |
| doi_str_mv | 10.1002/polb.10439 |
| format | Article |
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Thermally induced stress is calculated with a nonisothermal compressible flow simulation with a viscoelastic constitutive model. A finite element analysis is formulated with axisymmetric plate elements based on Kirchhoff thin‐plate theory to simulate the warpage of the disc due to the asymmetric thermal stress and gravity after demolding. Simulation results of warpage for compact‐disc‐recordable moldings are compared with experimental observations under different processing conditions, such as the melt temperature, mold temperature, and packing pressure, with an optical grade of polycarbonate. The comparison shows that the simulation well predicts the effects of various processing conditions. Both the simulation and experiment indicate that of the processing conditions, the mold temperature has the greatest effect on warpage. © 2003 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 41: 859–872, 2003</description><identifier>ISSN: 0887-6266</identifier><identifier>EISSN: 1099-0488</identifier><identifier>DOI: 10.1002/polb.10439</identifier><identifier>CODEN: JPLPAY</identifier><language>eng</language><publisher>New York: Wiley Subscription Services, Inc., A Wiley Company</publisher><subject>Applied sciences ; compact disc molding ; Exact sciences and technology ; injection compression ; injection molding ; Injection moulding ; Machinery and processing ; Moulding ; optical media ; Plastics ; polycarbonates ; Polymer industry, paints, wood ; residual stress ; Technology of polymers ; viscoelastic properties ; warpage</subject><ispartof>Journal of polymer science. 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Part B, Polymer physics</title><addtitle>J. Polym. Sci. B Polym. Phys</addtitle><description>The warpage of injection–compression‐molded optical media, such as compact discs and digital video discs, due to asymmetric cooling during production is predicted. Thermally induced stress is calculated with a nonisothermal compressible flow simulation with a viscoelastic constitutive model. A finite element analysis is formulated with axisymmetric plate elements based on Kirchhoff thin‐plate theory to simulate the warpage of the disc due to the asymmetric thermal stress and gravity after demolding. Simulation results of warpage for compact‐disc‐recordable moldings are compared with experimental observations under different processing conditions, such as the melt temperature, mold temperature, and packing pressure, with an optical grade of polycarbonate. The comparison shows that the simulation well predicts the effects of various processing conditions. Both the simulation and experiment indicate that of the processing conditions, the mold temperature has the greatest effect on warpage. © 2003 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 41: 859–872, 2003</description><subject>Applied sciences</subject><subject>compact disc molding</subject><subject>Exact sciences and technology</subject><subject>injection compression</subject><subject>injection molding</subject><subject>Injection moulding</subject><subject>Machinery and processing</subject><subject>Moulding</subject><subject>optical media</subject><subject>Plastics</subject><subject>polycarbonates</subject><subject>Polymer industry, paints, wood</subject><subject>residual stress</subject><subject>Technology of polymers</subject><subject>viscoelastic properties</subject><subject>warpage</subject><issn>0887-6266</issn><issn>1099-0488</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2003</creationdate><recordtype>article</recordtype><recordid>eNp9kE1LAzEQhoMoWKsXf0FB9CCsTpL9SI5atBVKK6gUvITZbCLRbXdNtmj_vVu36s3ThMnzPjAvIccULigAu6yrMm9fMZc7pEdByghiIXZJD4TIopSl6T45COEVoP1LZI-czNHX-GIGtTeF042rloPKDqq6cRrLwaJd4iHZs1gGc7SdffJ0e_M4HEeT2ehueDWJdMxTGRXMYgE0o1ILlmpApMLGzBaC8sTkKLRAjHleGJrxXMqc68zkmSwsSzjPE94nZ5239tX7yoRGLVzQpixxaapVUEyABEFpC553oPZVCN5YVXu3QL9WFNSmB7XpQX330MKnWyuG9iTrcald-EvEqaAMoOVox3240qz_Mar72eT6xx11GRca8_mbQf-m0oxniZpPR-p6-iBHzzBWKf8CbcJ7JQ</recordid><startdate>20030501</startdate><enddate>20030501</enddate><creator>Fan, Bingfeng</creator><creator>Kazmer, David O.</creator><creator>Bushko, Wit C.</creator><creator>Theriault, Richard P.</creator><creator>Poslinski, Andrew J.</creator><general>Wiley Subscription Services, Inc., A Wiley Company</general><general>Wiley</general><scope>BSCLL</scope><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SR</scope><scope>8FD</scope><scope>JG9</scope></search><sort><creationdate>20030501</creationdate><title>Warpage prediction of optical media</title><author>Fan, Bingfeng ; Kazmer, David O. ; Bushko, Wit C. ; Theriault, Richard P. ; Poslinski, Andrew J.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c4369-d2fad01719c826c0aa18f42fd8135eba8c8aa43bde173b99b3c7eb79df2533b53</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2003</creationdate><topic>Applied sciences</topic><topic>compact disc molding</topic><topic>Exact sciences and technology</topic><topic>injection compression</topic><topic>injection molding</topic><topic>Injection moulding</topic><topic>Machinery and processing</topic><topic>Moulding</topic><topic>optical media</topic><topic>Plastics</topic><topic>polycarbonates</topic><topic>Polymer industry, paints, wood</topic><topic>residual stress</topic><topic>Technology of polymers</topic><topic>viscoelastic properties</topic><topic>warpage</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Fan, Bingfeng</creatorcontrib><creatorcontrib>Kazmer, David O.</creatorcontrib><creatorcontrib>Bushko, Wit C.</creatorcontrib><creatorcontrib>Theriault, Richard P.</creatorcontrib><creatorcontrib>Poslinski, Andrew J.</creatorcontrib><collection>Istex</collection><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Engineered Materials Abstracts</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Journal of polymer science. Part B, Polymer physics</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Fan, Bingfeng</au><au>Kazmer, David O.</au><au>Bushko, Wit C.</au><au>Theriault, Richard P.</au><au>Poslinski, Andrew J.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Warpage prediction of optical media</atitle><jtitle>Journal of polymer science. Part B, Polymer physics</jtitle><addtitle>J. Polym. Sci. B Polym. Phys</addtitle><date>2003-05-01</date><risdate>2003</risdate><volume>41</volume><issue>9</issue><spage>859</spage><epage>872</epage><pages>859-872</pages><issn>0887-6266</issn><eissn>1099-0488</eissn><coden>JPLPAY</coden><abstract>The warpage of injection–compression‐molded optical media, such as compact discs and digital video discs, due to asymmetric cooling during production is predicted. Thermally induced stress is calculated with a nonisothermal compressible flow simulation with a viscoelastic constitutive model. A finite element analysis is formulated with axisymmetric plate elements based on Kirchhoff thin‐plate theory to simulate the warpage of the disc due to the asymmetric thermal stress and gravity after demolding. Simulation results of warpage for compact‐disc‐recordable moldings are compared with experimental observations under different processing conditions, such as the melt temperature, mold temperature, and packing pressure, with an optical grade of polycarbonate. The comparison shows that the simulation well predicts the effects of various processing conditions. Both the simulation and experiment indicate that of the processing conditions, the mold temperature has the greatest effect on warpage. © 2003 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 41: 859–872, 2003</abstract><cop>New York</cop><pub>Wiley Subscription Services, Inc., A Wiley Company</pub><doi>10.1002/polb.10439</doi><tpages>14</tpages></addata></record> |
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| language | eng |
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| source | Wiley Online Library Journals Frontfile Complete |
| subjects | Applied sciences compact disc molding Exact sciences and technology injection compression injection molding Injection moulding Machinery and processing Moulding optical media Plastics polycarbonates Polymer industry, paints, wood residual stress Technology of polymers viscoelastic properties warpage |
| title | Warpage prediction of optical media |
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