Inductance-controlled electroabsorption Modulator modules using the flip-chip bonding technique

The wire-bonding technique is widely used for the connections between the electroabsorption (EA) modulator chips and the electrical signal transmission lines. However, the parasitic inductance of the bonding wire degrades the electrical characteristics of the EA modulator modules in a high-frequency...

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Veröffentlicht in:	Journal of lightwave technology 2005-02, Vol.23 (2), p.582-587
Hauptverfasser:	Hatta, T., Miyahara, T., Ishizaki, M., Okada, N., Zaizen, S., Motoshima, K., Kasahara, K.
Format:	Artikel
Sprache:	eng
Schlagworte:	Bandwidth Bonding Capacitance Digital modulation Electric wire electroabsorption (EA) Electrodes flip-chip devices Gold Impedance Inductance Joints Modulators Modules Optical modulation Optimization Semiconductor materials Signal transmission Transmission line theory
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