Microswitches with sputtered Au, AuPd,Au-on-AuPt, and AuPtCu alloy electric contacts
This paper is the first to report on a new analytic model for predicting microcontact resistance and the design, fabrication, and testing of microelectromechanical systems (MEMS) metal contact switches with sputtered bimetallic (i.e., gold (Au)-on-Au-platinum (Pt), (Au-on-Au-(6.3at%)Pt)), binary all...
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| Veröffentlicht in: | IEEE transactions on components and packaging technologies 2006-06, Vol.29 (2), p.341-349 |
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| container_title | IEEE transactions on components and packaging technologies |
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| creator | Coutu, R.A. Reid, J.R. Cortez, R. Strawser, R.E. Kladitis, P.E. |
| description | This paper is the first to report on a new analytic model for predicting microcontact resistance and the design, fabrication, and testing of microelectromechanical systems (MEMS) metal contact switches with sputtered bimetallic (i.e., gold (Au)-on-Au-platinum (Pt), (Au-on-Au-(6.3at%)Pt)), binary alloy (i.e., Au-palladium (Pd), (Au-(3.7at%)Pd)), and ternary alloy (i.e., Au-Pt-copper (Cu), (Au-(5.0at%)Pt-(0.5at%)Cu)) electric contacts. The microswitches with bimetallic and binary alloy contacts resulted in contact resistance values between 1-2/spl Omega/. Preliminary reliability testing indicates a 3/spl times/ increase in switching lifetime when compared to microswitches with sputtered Au electric contacts. The ternary alloy exhibited approximately a 6/spl times/ increase in switch lifetime with contact resistance values ranging from approximately 0.2-1.8/spl Omega/. |
| doi_str_mv | 10.1109/TCAPT.2006.875898 |
| format | Article |
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The microswitches with bimetallic and binary alloy contacts resulted in contact resistance values between 1-2/spl Omega/. Preliminary reliability testing indicates a 3/spl times/ increase in switching lifetime when compared to microswitches with sputtered Au electric contacts. The ternary alloy exhibited approximately a 6/spl times/ increase in switch lifetime with contact resistance values ranging from approximately 0.2-1.8/spl Omega/.</description><identifier>ISSN: 1521-3331</identifier><identifier>EISSN: 1557-9972</identifier><identifier>DOI: 10.1109/TCAPT.2006.875898</identifier><identifier>CODEN: ITCPFB</identifier><language>eng</language><publisher>New York: IEEE</publisher><subject>Alloys ; Binary alloys ; Contact ; Contact resistance ; Copper alloys ; Electric contacts ; Electric resistance ; Fabrication ; Gold ; Gold alloys ; Gold base alloys ; Mathematical models ; microelectromechanical systems (MEMS) ; microswitch ; Microswitches ; Platinum alloys ; Predictive models ; Switches ; System testing ; Ternary alloys</subject><ispartof>IEEE transactions on components and packaging technologies, 2006-06, Vol.29 (2), p.341-349</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2006</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c462t-639c585245751702c3bf146c36a574b0b92847229efb68becd57c88bc04b420c3</citedby><cites>FETCH-LOGICAL-c462t-639c585245751702c3bf146c36a574b0b92847229efb68becd57c88bc04b420c3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/1637768$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>315,781,785,797,27929,27930,54763</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/1637768$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Coutu, R.A.</creatorcontrib><creatorcontrib>Reid, J.R.</creatorcontrib><creatorcontrib>Cortez, R.</creatorcontrib><creatorcontrib>Strawser, R.E.</creatorcontrib><creatorcontrib>Kladitis, P.E.</creatorcontrib><title>Microswitches with sputtered Au, AuPd,Au-on-AuPt, and AuPtCu alloy electric contacts</title><title>IEEE transactions on components and packaging technologies</title><addtitle>TCAPT</addtitle><description>This paper is the first to report on a new analytic model for predicting microcontact resistance and the design, fabrication, and testing of microelectromechanical systems (MEMS) metal contact switches with sputtered bimetallic (i.e., gold (Au)-on-Au-platinum (Pt), (Au-on-Au-(6.3at%)Pt)), binary alloy (i.e., Au-palladium (Pd), (Au-(3.7at%)Pd)), and ternary alloy (i.e., Au-Pt-copper (Cu), (Au-(5.0at%)Pt-(0.5at%)Cu)) electric contacts. The microswitches with bimetallic and binary alloy contacts resulted in contact resistance values between 1-2/spl Omega/. Preliminary reliability testing indicates a 3/spl times/ increase in switching lifetime when compared to microswitches with sputtered Au electric contacts. The ternary alloy exhibited approximately a 6/spl times/ increase in switch lifetime with contact resistance values ranging from approximately 0.2-1.8/spl Omega/.</description><subject>Alloys</subject><subject>Binary alloys</subject><subject>Contact</subject><subject>Contact resistance</subject><subject>Copper alloys</subject><subject>Electric contacts</subject><subject>Electric resistance</subject><subject>Fabrication</subject><subject>Gold</subject><subject>Gold alloys</subject><subject>Gold base alloys</subject><subject>Mathematical models</subject><subject>microelectromechanical systems (MEMS)</subject><subject>microswitch</subject><subject>Microswitches</subject><subject>Platinum alloys</subject><subject>Predictive models</subject><subject>Switches</subject><subject>System testing</subject><subject>Ternary alloys</subject><issn>1521-3331</issn><issn>1557-9972</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2006</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNqNkUtLw0AQgIMoWKs_QLwED-qhqbPv2WMpvqBiD_W8JNstRtKkZjdI_70bKwgeiodhBuabgZkvSc4JjAkBfbuYTuaLMQWQY1QCNR4kAyKEyrRW9LCvKckYY-Q4OfH-HYBw5HqQLJ5L2zb-swz2zfk05rfUb7oQXOuW6aQbxZgvR5Mua-oslmGU5nXfmIdpl-ZV1WxTVzkb2tKmtqlDboM_TY5WeeXd2U8eJq_3d4vpYzZ7eXiaTmaZ5ZKGTDJtBQrKhRJEAbWsWBEuLZO5ULyAQlPkilLtVoXEwtmlUBaxsMALTsGyYXK927tpm4_O-WDWpbeuqvLaNZ03qCVBAA2RvNpLUiSSSan_AQKXoFgEb_aC8SACyIH3Oy__oO9N19bxMwalZMhQ0giRHdTr8K1bmU1brvN2awiYXrH5Vmx6xWanOM5c7GZK59wvL5lSEtkXzYmfTw</recordid><startdate>20060601</startdate><enddate>20060601</enddate><creator>Coutu, R.A.</creator><creator>Reid, J.R.</creator><creator>Cortez, R.</creator><creator>Strawser, R.E.</creator><creator>Kladitis, P.E.</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. 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The microswitches with bimetallic and binary alloy contacts resulted in contact resistance values between 1-2/spl Omega/. Preliminary reliability testing indicates a 3/spl times/ increase in switching lifetime when compared to microswitches with sputtered Au electric contacts. The ternary alloy exhibited approximately a 6/spl times/ increase in switch lifetime with contact resistance values ranging from approximately 0.2-1.8/spl Omega/.</abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/TCAPT.2006.875898</doi><tpages>9</tpages><oa>free_for_read</oa></addata></record> |
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| source | IEEE Electronic Library (IEL) |
| subjects | Alloys Binary alloys Contact Contact resistance Copper alloys Electric contacts Electric resistance Fabrication Gold Gold alloys Gold base alloys Mathematical models microelectromechanical systems (MEMS) microswitch Microswitches Platinum alloys Predictive models Switches System testing Ternary alloys |
| title | Microswitches with sputtered Au, AuPd,Au-on-AuPt, and AuPtCu alloy electric contacts |
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