Thermal stress characteristics of two-level Al(Cu) interconnect structure
Thermal stress characteristics of single-level and two-level Al(Cu) interconnects passivated with tetraethyl orthosilicate oxide were measured using x-ray diffraction. Thermal stresses of the second-level metal lines were deduced from the experimental data based on an analysis of the x-ray absorptio...
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| Veröffentlicht in: | Journal of materials research 2003-04, Vol.18 (4), p.848-854 |
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| Hauptverfasser: | , |
| Format: | Artikel |
| Sprache: | eng |
| Online-Zugang: | Volltext |
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