Surface modification and characterization of photodefinable epoxy/copper systems
The effects of the wet-chemical and plasma treatments on the adhesion of electroless and sputter-deposited copper to the photodefinable epoxy have been investigated. The wet-chemical treatment increased the amounts of oxygen-containing functionalities on the epoxy surface mainly during the early sta...
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| Veröffentlicht in: | Thin solid films 2003-09, Vol.440 (1), p.198-207 |
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| creator | Ge, J Turunen, M.P.K Kivilahti, J.K |
| description | The effects of the wet-chemical and plasma treatments on the adhesion of electroless and sputter-deposited copper to the photodefinable epoxy have been investigated. The wet-chemical treatment increased the amounts of oxygen-containing functionalities on the epoxy surface mainly during the early stage of etching. With the longer etching the pronounced surface roughness was revealed in the form of microcavities. The plasma treatment increased significantly the polar component of surface free energy of the epoxy and produced low surface roughness. The physicochemical changes of the epoxy combined with the experimental adhesion results indicated that in the case of the electroless deposition the mechanical interlocking was the main adhesion mechanism. Sputter-deposited copper exhibited the highest pull strengths on the epoxy when the plasma pretreatment with oxygen was employed. The enhancement of the surface polarity of the epoxy and the enlarged surface contact area due to the increased roughness were the most important factors in the adhesion. |
| doi_str_mv | 10.1016/S0040-6090(03)00851-4 |
| format | Article |
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The wet-chemical treatment increased the amounts of oxygen-containing functionalities on the epoxy surface mainly during the early stage of etching. With the longer etching the pronounced surface roughness was revealed in the form of microcavities. The plasma treatment increased significantly the polar component of surface free energy of the epoxy and produced low surface roughness. The physicochemical changes of the epoxy combined with the experimental adhesion results indicated that in the case of the electroless deposition the mechanical interlocking was the main adhesion mechanism. Sputter-deposited copper exhibited the highest pull strengths on the epoxy when the plasma pretreatment with oxygen was employed. The enhancement of the surface polarity of the epoxy and the enlarged surface contact area due to the increased roughness were the most important factors in the adhesion.</description><identifier>ISSN: 0040-6090</identifier><identifier>EISSN: 1879-2731</identifier><identifier>DOI: 10.1016/S0040-6090(03)00851-4</identifier><identifier>CODEN: THSFAP</identifier><language>eng</language><publisher>Lausanne: Elsevier B.V</publisher><subject>Adhesion ; Condensed matter: structure, mechanical and thermal properties ; Cross-disciplinary physics: materials science; rheology ; Etching ; Exact sciences and technology ; Growth from solutions ; Interface structure and roughness ; Materials science ; Methods of crystal growth; physics of crystal growth ; Physics ; Plasma ; Polymer ; Solid surfaces and solid-solid interfaces ; Surface morphology ; Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties) ; X-ray photoelectron spectroscopy</subject><ispartof>Thin solid films, 2003-09, Vol.440 (1), p.198-207</ispartof><rights>2003 Elsevier B.V.</rights><rights>2004 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c368t-9d0f59964f69dcbe33e86f436f33407dab0c636029d53d33aa524b939cf380aa3</citedby><cites>FETCH-LOGICAL-c368t-9d0f59964f69dcbe33e86f436f33407dab0c636029d53d33aa524b939cf380aa3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://www.sciencedirect.com/science/article/pii/S0040609003008514$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,776,780,3537,27901,27902,65306</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=15071793$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Ge, J</creatorcontrib><creatorcontrib>Turunen, M.P.K</creatorcontrib><creatorcontrib>Kivilahti, J.K</creatorcontrib><title>Surface modification and characterization of photodefinable epoxy/copper systems</title><title>Thin solid films</title><description>The effects of the wet-chemical and plasma treatments on the adhesion of electroless and sputter-deposited copper to the photodefinable epoxy have been investigated. The wet-chemical treatment increased the amounts of oxygen-containing functionalities on the epoxy surface mainly during the early stage of etching. With the longer etching the pronounced surface roughness was revealed in the form of microcavities. The plasma treatment increased significantly the polar component of surface free energy of the epoxy and produced low surface roughness. The physicochemical changes of the epoxy combined with the experimental adhesion results indicated that in the case of the electroless deposition the mechanical interlocking was the main adhesion mechanism. Sputter-deposited copper exhibited the highest pull strengths on the epoxy when the plasma pretreatment with oxygen was employed. The enhancement of the surface polarity of the epoxy and the enlarged surface contact area due to the increased roughness were the most important factors in the adhesion.</description><subject>Adhesion</subject><subject>Condensed matter: structure, mechanical and thermal properties</subject><subject>Cross-disciplinary physics: materials science; rheology</subject><subject>Etching</subject><subject>Exact sciences and technology</subject><subject>Growth from solutions</subject><subject>Interface structure and roughness</subject><subject>Materials science</subject><subject>Methods of crystal growth; physics of crystal growth</subject><subject>Physics</subject><subject>Plasma</subject><subject>Polymer</subject><subject>Solid surfaces and solid-solid interfaces</subject><subject>Surface morphology</subject><subject>Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</subject><subject>X-ray photoelectron spectroscopy</subject><issn>0040-6090</issn><issn>1879-2731</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2003</creationdate><recordtype>article</recordtype><recordid>eNqFkE1LJDEQhoOs4Kz6E4S-rKyH1kpXd7pzkkX8AkFBPYeapIKRnk5v0iOOv97Rkd2jp4LieeulHiEOJBxLkOrkHqCGUoGG34BHAF0jy3pLzGTX6rJqUf4Qs3_IjviZ8zMAyKrCmbi7XyZPlotFdMEHS1OIQ0GDK-wTJbITp_C2WUZfjE9xio59GGjec8FjfF2d2DiOnIq8yhMv8p7Y9tRn3v-au-Lx4vzh7Kq8ub28PvtzU1pU3VRqB77RWtVeaWfnjMid8jUqj1hD62gOVqGCSrsGHSJRU9Vzjdp67IAId8Xh5u6Y4t8l58ksQrbc9zRwXGZTdQAKoVmDzQa0Keac2JsxhQWllZFgPvyZT3_mQ44BNJ_-TL3O_foqoGyp94kGG_L_cAOtbDWuudMNx-tvXwInk23gwbILie1kXAzfNL0DZfCFQA</recordid><startdate>20030901</startdate><enddate>20030901</enddate><creator>Ge, J</creator><creator>Turunen, M.P.K</creator><creator>Kivilahti, J.K</creator><general>Elsevier B.V</general><general>Elsevier Science</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope></search><sort><creationdate>20030901</creationdate><title>Surface modification and characterization of photodefinable epoxy/copper systems</title><author>Ge, J ; Turunen, M.P.K ; Kivilahti, J.K</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c368t-9d0f59964f69dcbe33e86f436f33407dab0c636029d53d33aa524b939cf380aa3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2003</creationdate><topic>Adhesion</topic><topic>Condensed matter: structure, mechanical and thermal properties</topic><topic>Cross-disciplinary physics: materials science; rheology</topic><topic>Etching</topic><topic>Exact sciences and technology</topic><topic>Growth from solutions</topic><topic>Interface structure and roughness</topic><topic>Materials science</topic><topic>Methods of crystal growth; physics of crystal growth</topic><topic>Physics</topic><topic>Plasma</topic><topic>Polymer</topic><topic>Solid surfaces and solid-solid interfaces</topic><topic>Surface morphology</topic><topic>Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</topic><topic>X-ray photoelectron spectroscopy</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Ge, J</creatorcontrib><creatorcontrib>Turunen, M.P.K</creatorcontrib><creatorcontrib>Kivilahti, J.K</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Engineered Materials Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Thin solid films</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Ge, J</au><au>Turunen, M.P.K</au><au>Kivilahti, J.K</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Surface modification and characterization of photodefinable epoxy/copper systems</atitle><jtitle>Thin solid films</jtitle><date>2003-09-01</date><risdate>2003</risdate><volume>440</volume><issue>1</issue><spage>198</spage><epage>207</epage><pages>198-207</pages><issn>0040-6090</issn><eissn>1879-2731</eissn><coden>THSFAP</coden><abstract>The effects of the wet-chemical and plasma treatments on the adhesion of electroless and sputter-deposited copper to the photodefinable epoxy have been investigated. The wet-chemical treatment increased the amounts of oxygen-containing functionalities on the epoxy surface mainly during the early stage of etching. With the longer etching the pronounced surface roughness was revealed in the form of microcavities. The plasma treatment increased significantly the polar component of surface free energy of the epoxy and produced low surface roughness. The physicochemical changes of the epoxy combined with the experimental adhesion results indicated that in the case of the electroless deposition the mechanical interlocking was the main adhesion mechanism. Sputter-deposited copper exhibited the highest pull strengths on the epoxy when the plasma pretreatment with oxygen was employed. The enhancement of the surface polarity of the epoxy and the enlarged surface contact area due to the increased roughness were the most important factors in the adhesion.</abstract><cop>Lausanne</cop><pub>Elsevier B.V</pub><doi>10.1016/S0040-6090(03)00851-4</doi><tpages>10</tpages></addata></record> |
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| language | eng |
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| source | Elsevier ScienceDirect Journals Complete |
| subjects | Adhesion Condensed matter: structure, mechanical and thermal properties Cross-disciplinary physics: materials science rheology Etching Exact sciences and technology Growth from solutions Interface structure and roughness Materials science Methods of crystal growth physics of crystal growth Physics Plasma Polymer Solid surfaces and solid-solid interfaces Surface morphology Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties) X-ray photoelectron spectroscopy |
| title | Surface modification and characterization of photodefinable epoxy/copper systems |
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