Structural Design and Research Progress of Thermally Conductive Polyimide Film – A Review

Currently, heat accumulation has seriously affected the stabilities and life of electronic devices. Polyimide (PI) film with high thermal conductivity coefficient (λ) has long been held up as an ideal solution for heat dissipation. Based on the thermal conduction mechanisms and classical thermal con...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Veröffentlicht in:	Macromolecular rapid communications. 2023-07, Vol.44 (13), p.e2300060-n/a
Hauptverfasser:	Tao, Kangkang, Sun, Gaohui, Feng, Chengcheng, Liu, Guangmin, Li, Yahui, Chen, Rongrong, Wang, Jun, Han, Shihui
Format:	Artikel
Sprache:	eng
Schlagworte:	Conduction Conduction heating Conduction model Electric Conductivity Electronic equipment Electronics Fillers Hot Temperature liquid crystalline Liquid Crystals polyimide films Reviews Structural design Structural engineering thermal conduction networks Thermal Conductivity thermal management
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!