Resonant vibration behavior of lead-free solders
This study investigated the resonant vibration-fatigue characteristics of some potential lead-free solders, including Sn-Zn, Sn-Ag Sn-Cu, and Sn-Bi alloys. Results show that, under a fixed vibration force, the damping capacity and vibration-fracture resistance of Sn-Cu and Sn-Ag eutectic alloys with...
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| Veröffentlicht in: | Journal of electronic materials 2003-12, Vol.32 (12), p.1501-1508 |
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| creator | SONG, J. M LUI, T. S CHEN, L. H TSAI, D. Y |
| description | This study investigated the resonant vibration-fatigue characteristics of some potential lead-free solders, including Sn-Zn, Sn-Ag Sn-Cu, and Sn-Bi alloys. Results show that, under a fixed vibration force, the damping capacity and vibration-fracture resistance of Sn-Cu and Sn-Ag eutectic alloys with an off-eutectic structure are higher than Sn-Pb and are also higher than Sn-Bi and Sn-Zn. This is closely related to the vibration-deformed structure and crack-propagation morphology associated with the microstructural features of the materials. Also, the striated deformation in the Sn-rich phase can be regarded as an effective mechanism in absorbing vibration energy. Moreover, microstructural modification of the Sn-Zn eutectic alloy can be achieved through Ag addition, and thus, the damping capacity and vibration-fracture resistance can be significantly improved. |
| doi_str_mv | 10.1007/s11664-003-0121-3 |
| format | Article |
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Moreover, microstructural modification of the Sn-Zn eutectic alloy can be achieved through Ag addition, and thus, the damping capacity and vibration-fracture resistance can be significantly improved.</description><identifier>ISSN: 0361-5235</identifier><identifier>EISSN: 1543-186X</identifier><identifier>DOI: 10.1007/s11664-003-0121-3</identifier><identifier>CODEN: JECMA5</identifier><language>eng</language><publisher>New York, NY: Institute of Electrical and Electronics Engineers</publisher><subject>Anelasticity, internal friction, stress relaxation, and mechanical resonances ; Condensed matter: structure, mechanical and thermal properties ; Exact sciences and technology ; Fatigue, brittleness, fracture, and cracks ; Mechanical and acoustical properties of condensed matter ; Mechanical properties of solids ; Physics</subject><ispartof>Journal of electronic materials, 2003-12, Vol.32 (12), p.1501-1508</ispartof><rights>2004 INIST-CNRS</rights><rights>Copyright Minerals, Metals & Materials Society Dec 2003</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c331t-50b17a526fd67036b2b2573660132fd2694ffe7521e83bb3f497019cb8d10af13</citedby><cites>FETCH-LOGICAL-c331t-50b17a526fd67036b2b2573660132fd2694ffe7521e83bb3f497019cb8d10af13</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>309,310,314,780,784,789,790,23930,23931,25140,27924,27925</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=15390674$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>SONG, J. 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Moreover, microstructural modification of the Sn-Zn eutectic alloy can be achieved through Ag addition, and thus, the damping capacity and vibration-fracture resistance can be significantly improved.</description><subject>Anelasticity, internal friction, stress relaxation, and mechanical resonances</subject><subject>Condensed matter: structure, mechanical and thermal properties</subject><subject>Exact sciences and technology</subject><subject>Fatigue, brittleness, fracture, and cracks</subject><subject>Mechanical and acoustical properties of condensed matter</subject><subject>Mechanical properties of solids</subject><subject>Physics</subject><issn>0361-5235</issn><issn>1543-186X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2003</creationdate><recordtype>article</recordtype><sourceid>8G5</sourceid><sourceid>ABUWG</sourceid><sourceid>AFKRA</sourceid><sourceid>AZQEC</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><sourceid>GNUQQ</sourceid><sourceid>GUQSH</sourceid><sourceid>M2O</sourceid><recordid>eNpdkE1LxDAQhoMouK7-AG9F0Ft0JmmS9iiLX7AgiIK3kLQJduk2a9Iu-O_NsguCp7k87zszDyGXCLcIoO4SopQlBeAUkCHlR2SGouQUK_l5TGbAJVLBuDglZymtAFBghTMCby6FwQxjse1sNGMXhsK6L7PtQiyCL3pnWuqjc0UKfetiOicn3vTJXRzmnHw8Prwvnuny9ellcb-kDec4UgEWlRFM-laqvNwyy4TiUgJy5lsm69J7pwRDV3FruS9rBVg3tmoRjEc-Jzf73k0M35NLo153qXF9bwYXpqSZqgXmJzJ49Q9chSkO-TbNoKyqrENmCPdQE0NK0Xm9id3axB-NoHcC9V6gzgL1TqDmOXN9KDapMb2PZmi69BcUvAapSv4L88htvQ</recordid><startdate>20031201</startdate><enddate>20031201</enddate><creator>SONG, J. 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M</au><au>LUI, T. S</au><au>CHEN, L. H</au><au>TSAI, D. Y</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Resonant vibration behavior of lead-free solders</atitle><jtitle>Journal of electronic materials</jtitle><date>2003-12-01</date><risdate>2003</risdate><volume>32</volume><issue>12</issue><spage>1501</spage><epage>1508</epage><pages>1501-1508</pages><issn>0361-5235</issn><eissn>1543-186X</eissn><coden>JECMA5</coden><abstract>This study investigated the resonant vibration-fatigue characteristics of some potential lead-free solders, including Sn-Zn, Sn-Ag Sn-Cu, and Sn-Bi alloys. Results show that, under a fixed vibration force, the damping capacity and vibration-fracture resistance of Sn-Cu and Sn-Ag eutectic alloys with an off-eutectic structure are higher than Sn-Pb and are also higher than Sn-Bi and Sn-Zn. This is closely related to the vibration-deformed structure and crack-propagation morphology associated with the microstructural features of the materials. Also, the striated deformation in the Sn-rich phase can be regarded as an effective mechanism in absorbing vibration energy. Moreover, microstructural modification of the Sn-Zn eutectic alloy can be achieved through Ag addition, and thus, the damping capacity and vibration-fracture resistance can be significantly improved.</abstract><cop>New York, NY</cop><pub>Institute of Electrical and Electronics Engineers</pub><doi>10.1007/s11664-003-0121-3</doi><tpages>8</tpages></addata></record> |
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| subjects | Anelasticity, internal friction, stress relaxation, and mechanical resonances Condensed matter: structure, mechanical and thermal properties Exact sciences and technology Fatigue, brittleness, fracture, and cracks Mechanical and acoustical properties of condensed matter Mechanical properties of solids Physics |
| title | Resonant vibration behavior of lead-free solders |
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