Effect of adsorption of polyoxyethylene laurylether on electrodeposition of Pb-free Sn alloys

Three plating baths (Sn–Cu, Sn–Bi and Sn–Ag–Cu) containing a polyoxyethylene laurylether (POELE) additive were developed as Pb-free solder plating solutions. The addition of POELE afforded a smooth, homogeneous alloy upon deposition. A mechanism for the effect of POELE in the electrodeposition proce...

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Veröffentlicht in:	Surface & coatings technology 2003-06, Vol.169, p.128-131
Hauptverfasser:	Fukuda, Mitsunobu, Imayoshi, Kohei, Matsumoto, Yasumichi
Format:	Artikel
Sprache:	eng
Schlagworte:	Bismuth Copper Electroplating Pb-free Silver Tin
Online-Zugang:	Volltext
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