Effect of adsorption of polyoxyethylene laurylether on electrodeposition of Pb-free Sn alloys
Three plating baths (Sn–Cu, Sn–Bi and Sn–Ag–Cu) containing a polyoxyethylene laurylether (POELE) additive were developed as Pb-free solder plating solutions. The addition of POELE afforded a smooth, homogeneous alloy upon deposition. A mechanism for the effect of POELE in the electrodeposition proce...
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| Veröffentlicht in: | Surface & coatings technology 2003-06, Vol.169, p.128-131 |
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| container_title | Surface & coatings technology |
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| creator | Fukuda, Mitsunobu Imayoshi, Kohei Matsumoto, Yasumichi |
| description | Three plating baths (Sn–Cu, Sn–Bi and Sn–Ag–Cu) containing a polyoxyethylene laurylether (POELE) additive were developed as Pb-free solder plating solutions. The addition of POELE afforded a smooth, homogeneous alloy upon deposition. A mechanism for the effect of POELE in the electrodeposition process is proposed in which POELE adsorbs on deposited Sn surfaces, suppressing subsequent deposition during electrolysis. The POELE remains on the surface of the deposited Sn as the plating layer grows, and is efficiently removed in the final water rinse. |
| doi_str_mv | 10.1016/S0257-8972(03)00191-9 |
| format | Article |
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The addition of POELE afforded a smooth, homogeneous alloy upon deposition. A mechanism for the effect of POELE in the electrodeposition process is proposed in which POELE adsorbs on deposited Sn surfaces, suppressing subsequent deposition during electrolysis. The POELE remains on the surface of the deposited Sn as the plating layer grows, and is efficiently removed in the final water rinse.</description><identifier>ISSN: 0257-8972</identifier><identifier>EISSN: 1879-3347</identifier><identifier>DOI: 10.1016/S0257-8972(03)00191-9</identifier><language>eng</language><publisher>Elsevier B.V</publisher><subject>Bismuth ; Copper ; Electroplating ; Pb-free ; Silver ; Tin</subject><ispartof>Surface & coatings technology, 2003-06, Vol.169, p.128-131</ispartof><rights>2003 Elsevier Science B.V.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c338t-520c7b5905197b53d7831a55960e1ea6503ec1bb12122bfdeb87e4251eed33a13</citedby><cites>FETCH-LOGICAL-c338t-520c7b5905197b53d7831a55960e1ea6503ec1bb12122bfdeb87e4251eed33a13</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://dx.doi.org/10.1016/S0257-8972(03)00191-9$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,776,780,3536,27903,27904,45974</link.rule.ids></links><search><creatorcontrib>Fukuda, Mitsunobu</creatorcontrib><creatorcontrib>Imayoshi, Kohei</creatorcontrib><creatorcontrib>Matsumoto, Yasumichi</creatorcontrib><title>Effect of adsorption of polyoxyethylene laurylether on electrodeposition of Pb-free Sn alloys</title><title>Surface & coatings technology</title><description>Three plating baths (Sn–Cu, Sn–Bi and Sn–Ag–Cu) containing a polyoxyethylene laurylether (POELE) additive were developed as Pb-free solder plating solutions. The addition of POELE afforded a smooth, homogeneous alloy upon deposition. A mechanism for the effect of POELE in the electrodeposition process is proposed in which POELE adsorbs on deposited Sn surfaces, suppressing subsequent deposition during electrolysis. 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The addition of POELE afforded a smooth, homogeneous alloy upon deposition. A mechanism for the effect of POELE in the electrodeposition process is proposed in which POELE adsorbs on deposited Sn surfaces, suppressing subsequent deposition during electrolysis. The POELE remains on the surface of the deposited Sn as the plating layer grows, and is efficiently removed in the final water rinse.</abstract><pub>Elsevier B.V</pub><doi>10.1016/S0257-8972(03)00191-9</doi><tpages>4</tpages></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 0257-8972 |
| ispartof | Surface & coatings technology, 2003-06, Vol.169, p.128-131 |
| issn | 0257-8972 1879-3347 |
| language | eng |
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| source | ScienceDirect Journals (5 years ago - present) |
| subjects | Bismuth Copper Electroplating Pb-free Silver Tin |
| title | Effect of adsorption of polyoxyethylene laurylether on electrodeposition of Pb-free Sn alloys |
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