Development of a directly bonded aluminum/alumina power electronic substrate

A process for manufacturing a directly bonded aluminum/alumina (DBA) power electronic substrate was developed in the present work. The bonding interface of the substrate was studied using transmission electron microscopy to elucidate the bonding mechanism of aluminum to alumina. The bonding strength...

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Veröffentlicht in:	Materials science & engineering. B, Solid-state materials for advanced technology Solid-state materials for advanced technology, 2003-05, Vol.99 (1), p.479-482
Hauptverfasser:	Ning, Xiao-Shan, Lin, Yuanbo, Xu, Wei, Peng, Rong, Zhou, Heping, Chen, Kexin
Format:	Artikel
Sprache:	eng
Schlagworte:	Alumina substrate Aluminum Bonding Interface TEM
Online-Zugang:	Volltext
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