Damage produced in model solder (Sn-37Pb) joints during thermomechanical cycling

The microstructure of solder plays a key role in the reliability of electronic packages. In this study, the cyclic shear deformation experienced by Sn-37Pb solder joints was simulated by thermomechanically cycling model joints between 30 deg C and 125 deg C, and the nature of the damage investigated...

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Veröffentlicht in:	Journal of electronic materials 2003-04, Vol.32 (4), p.278-286
Hauptverfasser:	LIU, X. W, PLUMBRIDGE, Wj
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Brazing. Soldering Exact sciences and technology Joining, thermal cutting: metallurgical aspects Metals. Metallurgy
Online-Zugang:	Volltext
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