Electroplating Ni micro-cantilevers for low contact-force IC probing

We present a new MEMS probe card made of electroplated nickel micro-cantilevers, which has compliant structures, and uses a kind of electric breakdown, or fritting, to make electric contacts to electrodes on ICs. The characteristics of fritting contact between nickel probe and Al electrodes were inv...

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Veröffentlicht in:Sensors and actuators. A. Physical. 2003-01, Vol.103 (1), p.116-121
Hauptverfasser: Kataoka, Kenichi, Kawamura, Shingo, Itoh, Toshihiro, Ishikawa, Kaoru, Honma, Hideo, Suga, Tadatomo
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container_end_page 121
container_issue 1
container_start_page 116
container_title Sensors and actuators. A. Physical.
container_volume 103
creator Kataoka, Kenichi
Kawamura, Shingo
Itoh, Toshihiro
Ishikawa, Kaoru
Honma, Hideo
Suga, Tadatomo
description We present a new MEMS probe card made of electroplated nickel micro-cantilevers, which has compliant structures, and uses a kind of electric breakdown, or fritting, to make electric contacts to electrodes on ICs. The characteristics of fritting contact between nickel probe and Al electrodes were investigated, and nickel was found to have lower contact resistance than other materials. A micro-machining process for the probe cards, including deposition of layers having different internal stress to make a protruding cantilever shape, was developed. It was found that the fritting process using the micro-cantilevers could make the low-resistance contacts with the force of less than a few micronewtons.
doi_str_mv 10.1016/S0924-4247(02)00312-6
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1873-3069
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source Elsevier ScienceDirect Journals
subjects Applied sciences
Electric contact
Electronics
Electroplated nickel
Exact sciences and technology
Fritting
MEMS probe card
Micro- and nanoelectromechanical devices (mems/nems)
Microcircuit quality, noise, performance, and failure analysis
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Testing, measurement, noise and reliability
title Electroplating Ni micro-cantilevers for low contact-force IC probing
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