Electroplating Ni micro-cantilevers for low contact-force IC probing
We present a new MEMS probe card made of electroplated nickel micro-cantilevers, which has compliant structures, and uses a kind of electric breakdown, or fritting, to make electric contacts to electrodes on ICs. The characteristics of fritting contact between nickel probe and Al electrodes were inv...
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Veröffentlicht in: | Sensors and actuators. A. Physical. 2003-01, Vol.103 (1), p.116-121 |
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container_title | Sensors and actuators. A. Physical. |
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creator | Kataoka, Kenichi Kawamura, Shingo Itoh, Toshihiro Ishikawa, Kaoru Honma, Hideo Suga, Tadatomo |
description | We present a new MEMS probe card made of electroplated nickel micro-cantilevers, which has compliant structures, and uses a kind of electric breakdown, or fritting, to make electric contacts to electrodes on ICs. The characteristics of fritting contact between nickel probe and Al electrodes were investigated, and nickel was found to have lower contact resistance than other materials. A micro-machining process for the probe cards, including deposition of layers having different internal stress to make a protruding cantilever shape, was developed. It was found that the fritting process using the micro-cantilevers could make the low-resistance contacts with the force of less than a few micronewtons. |
doi_str_mv | 10.1016/S0924-4247(02)00312-6 |
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The characteristics of fritting contact between nickel probe and Al electrodes were investigated, and nickel was found to have lower contact resistance than other materials. A micro-machining process for the probe cards, including deposition of layers having different internal stress to make a protruding cantilever shape, was developed. It was found that the fritting process using the micro-cantilevers could make the low-resistance contacts with the force of less than a few micronewtons.</description><identifier>ISSN: 0924-4247</identifier><identifier>EISSN: 1873-3069</identifier><identifier>DOI: 10.1016/S0924-4247(02)00312-6</identifier><language>eng</language><publisher>Lausanne: Elsevier B.V</publisher><subject>Applied sciences ; Electric contact ; Electronics ; Electroplated nickel ; Exact sciences and technology ; Fritting ; MEMS probe card ; Micro- and nanoelectromechanical devices (mems/nems) ; Microcircuit quality, noise, performance, and failure analysis ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices ; Testing, measurement, noise and reliability</subject><ispartof>Sensors and actuators. A. 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A. Physical.</title><description>We present a new MEMS probe card made of electroplated nickel micro-cantilevers, which has compliant structures, and uses a kind of electric breakdown, or fritting, to make electric contacts to electrodes on ICs. The characteristics of fritting contact between nickel probe and Al electrodes were investigated, and nickel was found to have lower contact resistance than other materials. A micro-machining process for the probe cards, including deposition of layers having different internal stress to make a protruding cantilever shape, was developed. It was found that the fritting process using the micro-cantilevers could make the low-resistance contacts with the force of less than a few micronewtons.</description><subject>Applied sciences</subject><subject>Electric contact</subject><subject>Electronics</subject><subject>Electroplated nickel</subject><subject>Exact sciences and technology</subject><subject>Fritting</subject><subject>MEMS probe card</subject><subject>Micro- and nanoelectromechanical devices (mems/nems)</subject><subject>Microcircuit quality, noise, performance, and failure analysis</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>Testing, measurement, noise and reliability</subject><issn>0924-4247</issn><issn>1873-3069</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2003</creationdate><recordtype>article</recordtype><recordid>eNqFkE1LAzEURYMoWKs_QZiNootoviaZWYnUqoWiC3UdMumLRNKZmkwr_nvTD3TpKoScm_veQeiUkitKqLx-ITUTWDChLgi7JIRThuUeGtBKccyJrPfR4Bc5REcpfZBMcaUG6G4cwPaxWwTT-_a9ePLF3NvYYWva3gdYQUyF62IRuq_Cdm1vbI_z3UIxGRWL2DU5dYwOnAkJTnbnEL3dj19Hj3j6_DAZ3U6xFVz0mAoLzLmqLME2UjJmQFZqBjXjTlaCNE1Vc-V4lV9myglV8sY6QTmpamFKxYfofPtv7v1cQur13CcLIZgWumXSTFVMCF5msNyCeZOUIji9iH5u4remRK-d6Y0zvRaiCdMbZ1rm3NmuwCRrgoumtT79hYXIs0meuZstB3nblYeok_XQWpj5mHXqWef_afoBvOl_nw</recordid><startdate>20030115</startdate><enddate>20030115</enddate><creator>Kataoka, Kenichi</creator><creator>Kawamura, Shingo</creator><creator>Itoh, Toshihiro</creator><creator>Ishikawa, Kaoru</creator><creator>Honma, Hideo</creator><creator>Suga, Tadatomo</creator><general>Elsevier B.V</general><general>Elsevier Science</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>7TB</scope><scope>8FD</scope><scope>FR3</scope><scope>L7M</scope></search><sort><creationdate>20030115</creationdate><title>Electroplating Ni micro-cantilevers for low contact-force IC probing</title><author>Kataoka, Kenichi ; Kawamura, Shingo ; Itoh, Toshihiro ; Ishikawa, Kaoru ; Honma, Hideo ; Suga, Tadatomo</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c434t-14ce2ff855ecb6622ae687de923f6840bb8937f3822ad7f4753bcf4130894a573</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2003</creationdate><topic>Applied sciences</topic><topic>Electric contact</topic><topic>Electronics</topic><topic>Electroplated nickel</topic><topic>Exact sciences and technology</topic><topic>Fritting</topic><topic>MEMS probe card</topic><topic>Micro- and nanoelectromechanical devices (mems/nems)</topic><topic>Microcircuit quality, noise, performance, and failure analysis</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><topic>Testing, measurement, noise and reliability</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Kataoka, Kenichi</creatorcontrib><creatorcontrib>Kawamura, Shingo</creatorcontrib><creatorcontrib>Itoh, Toshihiro</creatorcontrib><creatorcontrib>Ishikawa, Kaoru</creatorcontrib><creatorcontrib>Honma, Hideo</creatorcontrib><creatorcontrib>Suga, Tadatomo</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>Technology Research Database</collection><collection>Engineering Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Sensors and actuators. A. Physical.</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Kataoka, Kenichi</au><au>Kawamura, Shingo</au><au>Itoh, Toshihiro</au><au>Ishikawa, Kaoru</au><au>Honma, Hideo</au><au>Suga, Tadatomo</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Electroplating Ni micro-cantilevers for low contact-force IC probing</atitle><jtitle>Sensors and actuators. A. Physical.</jtitle><date>2003-01-15</date><risdate>2003</risdate><volume>103</volume><issue>1</issue><spage>116</spage><epage>121</epage><pages>116-121</pages><issn>0924-4247</issn><eissn>1873-3069</eissn><abstract>We present a new MEMS probe card made of electroplated nickel micro-cantilevers, which has compliant structures, and uses a kind of electric breakdown, or fritting, to make electric contacts to electrodes on ICs. The characteristics of fritting contact between nickel probe and Al electrodes were investigated, and nickel was found to have lower contact resistance than other materials. A micro-machining process for the probe cards, including deposition of layers having different internal stress to make a protruding cantilever shape, was developed. It was found that the fritting process using the micro-cantilevers could make the low-resistance contacts with the force of less than a few micronewtons.</abstract><cop>Lausanne</cop><pub>Elsevier B.V</pub><doi>10.1016/S0924-4247(02)00312-6</doi><tpages>6</tpages></addata></record> |
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subjects | Applied sciences Electric contact Electronics Electroplated nickel Exact sciences and technology Fritting MEMS probe card Micro- and nanoelectromechanical devices (mems/nems) Microcircuit quality, noise, performance, and failure analysis Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Testing, measurement, noise and reliability |
title | Electroplating Ni micro-cantilevers for low contact-force IC probing |
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