Characterization of polycrystalline SiC layers grown by ECR-PECVD for micro-electro-mechanical systems
Large area (up to 4 inch) polycrystalline 3C-SiC films have been deposited by electron cyclotron resonance chemical vapor deposition technique. Crystalline and non-crystalline substrates such as (1 0 0) Si wafers, thermally oxidized Si wafers and Al 2O 3 ceramic sheets have been used, maintaining th...
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Veröffentlicht in: | Thin solid films 2003-03, Vol.427 (1), p.187-190 |
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Hauptverfasser: | , , , , , , |
Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | Large area (up to 4 inch) polycrystalline 3C-SiC films have been deposited by electron cyclotron resonance chemical vapor deposition technique. Crystalline and non-crystalline substrates such as (1
0
0) Si wafers, thermally oxidized Si wafers and Al
2O
3 ceramic sheets have been used, maintaining the same deposition conditions. The structural and morphological properties of the films were analyzed by means of transmission electron microscopy and X-ray diffractometry, while surface morphology was characterized by atomic force microscopy. Preliminary results on technological processes for the realization of polycrystalline SiC based micro-electro-mechanical systems are reported. |
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ISSN: | 0040-6090 1879-2731 |
DOI: | 10.1016/S0040-6090(02)01222-1 |