Characterization of polycrystalline SiC layers grown by ECR-PECVD for micro-electro-mechanical systems

Large area (up to 4 inch) polycrystalline 3C-SiC films have been deposited by electron cyclotron resonance chemical vapor deposition technique. Crystalline and non-crystalline substrates such as (1 0 0) Si wafers, thermally oxidized Si wafers and Al 2O 3 ceramic sheets have been used, maintaining th...

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Veröffentlicht in:Thin solid films 2003-03, Vol.427 (1), p.187-190
Hauptverfasser: Ricciardi, C., Bennici, E., Cocuzza, M., Mandracci, P., Bich, D., Guglielmetti, V., Barucca, G.
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Sprache:eng
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Zusammenfassung:Large area (up to 4 inch) polycrystalline 3C-SiC films have been deposited by electron cyclotron resonance chemical vapor deposition technique. Crystalline and non-crystalline substrates such as (1 0 0) Si wafers, thermally oxidized Si wafers and Al 2O 3 ceramic sheets have been used, maintaining the same deposition conditions. The structural and morphological properties of the films were analyzed by means of transmission electron microscopy and X-ray diffractometry, while surface morphology was characterized by atomic force microscopy. Preliminary results on technological processes for the realization of polycrystalline SiC based micro-electro-mechanical systems are reported.
ISSN:0040-6090
1879-2731
DOI:10.1016/S0040-6090(02)01222-1