Characterisation of a BN magnetron sputtering process with an additional aluminium sputter electrode
The deposition of boron nitride (BN) films by r.f. magnetron sputtering of a hexagonal BN target with intended additional aluminium incorporation has been studied using various in situ plasma diagnostic techniques. The aluminium flux towards the substrates was supplied by an additional ring-shaped a...
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| Veröffentlicht in: | Surface & coatings technology 2003-03, Vol.166 (1), p.51-59 |
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| creator | Welzel, Th Pfeifer, Th Dunger, Th Richter, F. |
| description | The deposition of boron nitride (BN) films by r.f. magnetron sputtering of a hexagonal BN target with intended additional aluminium incorporation has been studied using various in situ plasma diagnostic techniques. The aluminium flux towards the substrates was supplied by an additional ring-shaped aluminium electrode mounted all around the circular magnetron. Langmuir double probe investigations reveal only little influence of the electrode position and electrostatic potential on the magnetron discharge. The most appropriate electrode position was found to be levelled with the anode of the magnetron. The aluminium density in the gas phase was investigated by laser-induced fluorescence and optical emission spectroscopy (OES) yielding an increase with the square of the electrode power. Moreover, a strong dependence on the Ar–N
2 gas mixture was observed which is explained by nitride formation on the surface. OES measurements also imply a significant hydrogen and boron contamination of the electrode during its power-off phases. |
| doi_str_mv | 10.1016/S0257-8972(02)00721-1 |
| format | Article |
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2 gas mixture was observed which is explained by nitride formation on the surface. OES measurements also imply a significant hydrogen and boron contamination of the electrode during its power-off phases.</description><subject>Aluminium</subject><subject>Boron nitride</subject><subject>Cross-disciplinary physics: materials science; rheology</subject><subject>Deposition by sputtering</subject><subject>Exact sciences and technology</subject><subject>Magnetron</subject><subject>Materials science</subject><subject>Methods of deposition of films and coatings; film growth and epitaxy</subject><subject>Physics</subject><subject>Reactive sputtering</subject><issn>0257-8972</issn><issn>1879-3347</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2003</creationdate><recordtype>article</recordtype><recordid>eNqFkF1LHTEQhkOp0NNjf0IhN0p7sTrJbjabK7GH-gGiF_U-jMmspuzHMdlV-u_NerS9LAwEhuedmTyMfRVwJEDUx79AKl00RstvIL8DaCkK8YGtRKNNUZaV_shWf5FP7HNKvwFAaFOtmN88YEQ3UQwJpzAOfGw58h_XvMf7gaaYO2k7Twsw3PNtHB2lxJ_D9MBx4Oh9WFLYcezmPgxh7t95Th25PMDTPttrsUv05e1ds9uzn7ebi-Lq5vxyc3pVuLJupqKRYLQStWm1pLKG1mGtPOIdonFA3lSVMoRCVa4SZQmCjJFeKnUnocWyXLPD3dh85eNMabJ9SI66Dgca52SlbqBuTJ1BtQNdHFOK1NptDD3GP1aAXZTaV6V28WUh16LUipw7eFuAyWHXRhxcSP_ClQKta8jcyY6j_NmnQNEmF2hw5EPMSqwfw382vQA-poxL</recordid><startdate>20030303</startdate><enddate>20030303</enddate><creator>Welzel, Th</creator><creator>Pfeifer, Th</creator><creator>Dunger, Th</creator><creator>Richter, F.</creator><general>Elsevier B.V</general><general>Elsevier</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SR</scope><scope>8FD</scope><scope>JG9</scope></search><sort><creationdate>20030303</creationdate><title>Characterisation of a BN magnetron sputtering process with an additional aluminium sputter electrode</title><author>Welzel, Th ; Pfeifer, Th ; Dunger, Th ; Richter, F.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c368t-820975169f72e360fca65daabaa9c0ed94459ea154c413301e992d255b20fa33</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2003</creationdate><topic>Aluminium</topic><topic>Boron nitride</topic><topic>Cross-disciplinary physics: materials science; rheology</topic><topic>Deposition by sputtering</topic><topic>Exact sciences and technology</topic><topic>Magnetron</topic><topic>Materials science</topic><topic>Methods of deposition of films and coatings; film growth and epitaxy</topic><topic>Physics</topic><topic>Reactive sputtering</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Welzel, Th</creatorcontrib><creatorcontrib>Pfeifer, Th</creatorcontrib><creatorcontrib>Dunger, Th</creatorcontrib><creatorcontrib>Richter, F.</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Engineered Materials Abstracts</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Surface & coatings technology</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Welzel, Th</au><au>Pfeifer, Th</au><au>Dunger, Th</au><au>Richter, F.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Characterisation of a BN magnetron sputtering process with an additional aluminium sputter electrode</atitle><jtitle>Surface & coatings technology</jtitle><date>2003-03-03</date><risdate>2003</risdate><volume>166</volume><issue>1</issue><spage>51</spage><epage>59</epage><pages>51-59</pages><issn>0257-8972</issn><eissn>1879-3347</eissn><coden>SCTEEJ</coden><abstract>The deposition of boron nitride (BN) films by r.f. magnetron sputtering of a hexagonal BN target with intended additional aluminium incorporation has been studied using various in situ plasma diagnostic techniques. The aluminium flux towards the substrates was supplied by an additional ring-shaped aluminium electrode mounted all around the circular magnetron. Langmuir double probe investigations reveal only little influence of the electrode position and electrostatic potential on the magnetron discharge. The most appropriate electrode position was found to be levelled with the anode of the magnetron. The aluminium density in the gas phase was investigated by laser-induced fluorescence and optical emission spectroscopy (OES) yielding an increase with the square of the electrode power. Moreover, a strong dependence on the Ar–N
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| subjects | Aluminium Boron nitride Cross-disciplinary physics: materials science rheology Deposition by sputtering Exact sciences and technology Magnetron Materials science Methods of deposition of films and coatings film growth and epitaxy Physics Reactive sputtering |
| title | Characterisation of a BN magnetron sputtering process with an additional aluminium sputter electrode |
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