Characterization of chemically-deposited NiB and NiWB thin films as a capping layer for ULSI application

Characterization of chemically-deposited NiB and NiWB thin films as a capping layer for ULSI application

NiB and NiWB films fabricated by electroless deposition were evaluated aiming for the application to a metal cap in the copper interconnects technology. The content of B and W was varied by adjusting the concentration of components in electroless deposition baths in order to clarify the effect of co...

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Veröffentlicht in:Surface & coatings technology 2003-06, Vol.169, p.124-127
Hauptverfasser: Osaka, Tetsuya, Takano, Nao, Kurokawa, Tetsuya, Kaneko, Tomomi, Ueno, Kazuyoshi
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Sprache:eng
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Capping layer
Electroless deposition
Ni–B alloy
Thermal stability
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container_issue
container_start_page 124
container_title Surface & coatings technology
container_volume 169
creator Osaka, Tetsuya
Takano, Nao
Kurokawa, Tetsuya
Kaneko, Tomomi
Ueno, Kazuyoshi
description NiB and NiWB films fabricated by electroless deposition were evaluated aiming for the application to a metal cap in the copper interconnects technology. The content of B and W was varied by adjusting the concentration of components in electroless deposition baths in order to clarify the effect of co-deposited element on thermal stability of the films. The thermal stability was evaluated by Auger electron spectroscope, X-ray diffractometer (XRD) and sheet resistance measurement. By measuring the variation in sheet resistance with annealing temperature, it was confirmed that the NiB films showed good thermal stability up to 450 °C, whereas the NiWB films deteriorated at 300 °C. The effect of co-deposited element was discussed based on the results obtained by XRD as well as that of sheet resistance measurement.
doi_str_mv 10.1016/S0257-8972(03)00186-5
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subjects Capping layer
Electroless deposition
Ni–B alloy
Thermal stability
title Characterization of chemically-deposited NiB and NiWB thin films as a capping layer for ULSI application
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