3D Nonlinear Stress Analysis of Tin Whisker Initiation on Lead-Free Components
In this study, a three-dimensional (3D) nonlinear stress analysis of the tin whisker initiation on a pure matte Sn-plated copper substrate is investigated. The structure is subjected to a compressive stress acting at the Sn layer which is generated by the spontaneous chemical reaction of the Sn laye...
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| Veröffentlicht in: | Journal of electronic packaging 2003-12, Vol.125 (4), p.621-624 |
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| Hauptverfasser: | , |
| Format: | Artikel |
| Sprache: | eng |
| Online-Zugang: | Volltext |
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