Thermal conductivity of suspension containing SiC particles

Thermal conductivity of suspension containing SiC particles were investigated. Three types of alpha -SiC powder were dispersed in water and ethylene glycol (EG) respectively. The pH values of all the aqueous suspensions were adjusted to 10.0. The thermal conductivities of the suspensions were measur...

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Veröffentlicht in:Journal of materials science letters 2002-02, Vol.21 (3), p.193-195
Hauptverfasser: Xie, Huaqing, Wang, Jinchang, Xi, Tonggeng, Liu, Yan, Ai, Fei
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container_title Journal of materials science letters
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creator Xie, Huaqing
Wang, Jinchang
Xi, Tonggeng
Liu, Yan
Ai, Fei
description Thermal conductivity of suspension containing SiC particles were investigated. Three types of alpha -SiC powder were dispersed in water and ethylene glycol (EG) respectively. The pH values of all the aqueous suspensions were adjusted to 10.0. The thermal conductivities of the suspensions were measured by using hot-wire method at a temperature of 4 degree C. The results showed that the thermal conductivities of the suspensions with a small amount of SiC particles had higher thermal conductivity than those of the base fluids without solid particles.
doi_str_mv 10.1023/A:1014742722343
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fullrecord <record><control><sourceid>proquest_pasca</sourceid><recordid>TN_cdi_proquest_miscellaneous_27780626</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>27776145</sourcerecordid><originalsourceid>FETCH-LOGICAL-c291t-ae213b1c01e304cfcf1ed990713778729619853b8117aed55615e2fa82883ebd3</originalsourceid><addsrcrecordid>eNqNjDtPhEAURqfQxHW1tqXRDp17h3mg1Yb4SjaxcK3JMFx0DAzIgMn-ezHuD7D6kvOdHMYugF8DR3GzuQUOmc5QI4pMHLEVRwWp4WhO2GmMn5wvQGYrdrf7oLGzbeL6UM9u8t9-2id9k8Q5DhSi78PvNVkffHhPXn2RDHacvGspnrHjxraRzg-7Zm8P97viKd2-PD4Xm23qMIcptYQgKnAcSPDMNa4BqvOcaxBaG425gtxIURkAbamWUoEkbKxBYwRVtVizq7_uMPZfM8Wp7Hx01LY2UD_HEpcMV6j-I2oFmVzEy4Noo7NtM9rgfCyH0Xd23JcglNByCf4AX35i4Q</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>27776145</pqid></control><display><type>article</type><title>Thermal conductivity of suspension containing SiC particles</title><source>SpringerLink Journals - AutoHoldings</source><creator>Xie, Huaqing ; Wang, Jinchang ; Xi, Tonggeng ; Liu, Yan ; Ai, Fei</creator><contributor>WCA</contributor><creatorcontrib>Xie, Huaqing ; Wang, Jinchang ; Xi, Tonggeng ; Liu, Yan ; Ai, Fei ; WCA</creatorcontrib><description>Thermal conductivity of suspension containing SiC particles were investigated. Three types of alpha -SiC powder were dispersed in water and ethylene glycol (EG) respectively. The pH values of all the aqueous suspensions were adjusted to 10.0. The thermal conductivities of the suspensions were measured by using hot-wire method at a temperature of 4 degree C. The results showed that the thermal conductivities of the suspensions with a small amount of SiC particles had higher thermal conductivity than those of the base fluids without solid particles.</description><identifier>ISSN: 0261-8028</identifier><identifier>DOI: 10.1023/A:1014742722343</identifier><identifier>CODEN: JMSLD5</identifier><language>eng</language><publisher>Dordrecht: Kluwer Academic Publishers</publisher><subject>Chemistry ; Colloidal state and disperse state ; Exact sciences and technology ; General and physical chemistry ; Physical and chemical studies. Granulometry. Electrokinetic phenomena</subject><ispartof>Journal of materials science letters, 2002-02, Vol.21 (3), p.193-195</ispartof><rights>2002 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c291t-ae213b1c01e304cfcf1ed990713778729619853b8117aed55615e2fa82883ebd3</citedby></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784,27924,27925</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&amp;idt=13637526$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><contributor>WCA</contributor><creatorcontrib>Xie, Huaqing</creatorcontrib><creatorcontrib>Wang, Jinchang</creatorcontrib><creatorcontrib>Xi, Tonggeng</creatorcontrib><creatorcontrib>Liu, Yan</creatorcontrib><creatorcontrib>Ai, Fei</creatorcontrib><title>Thermal conductivity of suspension containing SiC particles</title><title>Journal of materials science letters</title><description>Thermal conductivity of suspension containing SiC particles were investigated. Three types of alpha -SiC powder were dispersed in water and ethylene glycol (EG) respectively. The pH values of all the aqueous suspensions were adjusted to 10.0. The thermal conductivities of the suspensions were measured by using hot-wire method at a temperature of 4 degree C. The results showed that the thermal conductivities of the suspensions with a small amount of SiC particles had higher thermal conductivity than those of the base fluids without solid particles.</description><subject>Chemistry</subject><subject>Colloidal state and disperse state</subject><subject>Exact sciences and technology</subject><subject>General and physical chemistry</subject><subject>Physical and chemical studies. Granulometry. Electrokinetic phenomena</subject><issn>0261-8028</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2002</creationdate><recordtype>article</recordtype><recordid>eNqNjDtPhEAURqfQxHW1tqXRDp17h3mg1Yb4SjaxcK3JMFx0DAzIgMn-ezHuD7D6kvOdHMYugF8DR3GzuQUOmc5QI4pMHLEVRwWp4WhO2GmMn5wvQGYrdrf7oLGzbeL6UM9u8t9-2id9k8Q5DhSi78PvNVkffHhPXn2RDHacvGspnrHjxraRzg-7Zm8P97viKd2-PD4Xm23qMIcptYQgKnAcSPDMNa4BqvOcaxBaG425gtxIURkAbamWUoEkbKxBYwRVtVizq7_uMPZfM8Wp7Hx01LY2UD_HEpcMV6j-I2oFmVzEy4Noo7NtM9rgfCyH0Xd23JcglNByCf4AX35i4Q</recordid><startdate>20020201</startdate><enddate>20020201</enddate><creator>Xie, Huaqing</creator><creator>Wang, Jinchang</creator><creator>Xi, Tonggeng</creator><creator>Liu, Yan</creator><creator>Ai, Fei</creator><general>Kluwer Academic Publishers</general><scope>IQODW</scope><scope>7U5</scope><scope>8FD</scope><scope>L7M</scope><scope>7QQ</scope><scope>JG9</scope></search><sort><creationdate>20020201</creationdate><title>Thermal conductivity of suspension containing SiC particles</title><author>Xie, Huaqing ; Wang, Jinchang ; Xi, Tonggeng ; Liu, Yan ; Ai, Fei</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c291t-ae213b1c01e304cfcf1ed990713778729619853b8117aed55615e2fa82883ebd3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2002</creationdate><topic>Chemistry</topic><topic>Colloidal state and disperse state</topic><topic>Exact sciences and technology</topic><topic>General and physical chemistry</topic><topic>Physical and chemical studies. Granulometry. Electrokinetic phenomena</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Xie, Huaqing</creatorcontrib><creatorcontrib>Wang, Jinchang</creatorcontrib><creatorcontrib>Xi, Tonggeng</creatorcontrib><creatorcontrib>Liu, Yan</creatorcontrib><creatorcontrib>Ai, Fei</creatorcontrib><collection>Pascal-Francis</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Ceramic Abstracts</collection><collection>Materials Research Database</collection><jtitle>Journal of materials science letters</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Xie, Huaqing</au><au>Wang, Jinchang</au><au>Xi, Tonggeng</au><au>Liu, Yan</au><au>Ai, Fei</au><au>WCA</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Thermal conductivity of suspension containing SiC particles</atitle><jtitle>Journal of materials science letters</jtitle><date>2002-02-01</date><risdate>2002</risdate><volume>21</volume><issue>3</issue><spage>193</spage><epage>195</epage><pages>193-195</pages><issn>0261-8028</issn><coden>JMSLD5</coden><abstract>Thermal conductivity of suspension containing SiC particles were investigated. Three types of alpha -SiC powder were dispersed in water and ethylene glycol (EG) respectively. The pH values of all the aqueous suspensions were adjusted to 10.0. The thermal conductivities of the suspensions were measured by using hot-wire method at a temperature of 4 degree C. The results showed that the thermal conductivities of the suspensions with a small amount of SiC particles had higher thermal conductivity than those of the base fluids without solid particles.</abstract><cop>Dordrecht</cop><pub>Kluwer Academic Publishers</pub><doi>10.1023/A:1014742722343</doi><tpages>3</tpages></addata></record>
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subjects Chemistry
Colloidal state and disperse state
Exact sciences and technology
General and physical chemistry
Physical and chemical studies. Granulometry. Electrokinetic phenomena
title Thermal conductivity of suspension containing SiC particles
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-06T03%3A29%3A35IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_pasca&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Thermal%20conductivity%20of%20suspension%20containing%20SiC%20particles&rft.jtitle=Journal%20of%20materials%20science%20letters&rft.au=Xie,%20Huaqing&rft.date=2002-02-01&rft.volume=21&rft.issue=3&rft.spage=193&rft.epage=195&rft.pages=193-195&rft.issn=0261-8028&rft.coden=JMSLD5&rft_id=info:doi/10.1023/A:1014742722343&rft_dat=%3Cproquest_pasca%3E27776145%3C/proquest_pasca%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=27776145&rft_id=info:pmid/&rfr_iscdi=true