Studies on buried layer resistors
Multilayer thick-film technology is one of the important technologies adopted in the miniaturization of electronic systems. Generally, only interconnections are made in the intermediate layers. The possibility of fabricating resistors along with interconnections in the buried layers/intermediate lay...
Gespeichert in:
Veröffentlicht in: | Journal of materials science. Materials in electronics 2002-10, Vol.13 (10), p.615-620 |
---|---|
Hauptverfasser: | , , , , |
Format: | Artikel |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | 620 |
---|---|
container_issue | 10 |
container_start_page | 615 |
container_title | Journal of materials science. Materials in electronics |
container_volume | 13 |
creator | YADAGIRI, G GOSWAMI, K. K GURUMURTHY, K. S SATYAM, M SHANKARA, K. N |
description | Multilayer thick-film technology is one of the important technologies adopted in the miniaturization of electronic systems. Generally, only interconnections are made in the intermediate layers. The possibility of fabricating resistors along with interconnections in the buried layers/intermediate layers using conventional thick-film materials has been examined in this study. The fabrication has been carried out by processing layer after layer. It has been found that the buried layer resistors exhibited a sheet resistivity lower than those fabricated as open resistors. This change in sheet resistivity has been attributed to multiple firings that the resistors undergo during the fabrication. This reduction in sheet resistivity has been found to be due to segregation of active materials. A model has been proposed to explain this change in sheet resistivity through segregation of the active material. The work reported in the paper clearly indicates that buried resistors with consistent values (±10%) can be fabricated using conventional materials. However, the design of the resistors has to be carried out using modified sheet resistivities. The model that is proposed also indicates how one can make a paste that is likely to exhibit the same sheet resistivity for buried resistors and open resistors.[PUBLICATION ABSTRACT] |
doi_str_mv | 10.1023/A:1020112501154 |
format | Article |
fullrecord | <record><control><sourceid>proquest_pasca</sourceid><recordid>TN_cdi_proquest_miscellaneous_27727317</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>2433711511</sourcerecordid><originalsourceid>FETCH-LOGICAL-p305t-25fa7f8cf7613fd851ab6e3e0e252e20d3a8c4f3b131cb8e6a84d44a8b9e2643</originalsourceid><addsrcrecordid>eNqN0D1PwzAQBmALgUQozKwBCcQSsM92zmarKr6kSgx0YIuc5CylSpNiJ0P_PanoxIBY7l0e3Rdjl4LfCw7yYf44BRcC9FS0OmKJ0CgzZeDzmCXcasyUBjhlZzGuOee5kiZhVx_DWDcU075LyzE0VKet21FIA8UmDn2I5-zEuzbSxSFnbPX8tFq8Zsv3l7fFfJltJddDBto79KbymAvpa6OFK3OSxAk0EPBaOlMpL0shRVUayp1RtVLOlJZg2mXGbn_abkP_NVIcik0TK2pb11E_xgIQAaXA_8DpD9ZO8O5PKHIUAGj0nl7_out-DN10bmGMMog23w--OSAXK9f64LqqicU2NBsXdoVQSlqOXH4D7_R0vw</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>884877967</pqid></control><display><type>article</type><title>Studies on buried layer resistors</title><source>SpringerNature Journals</source><creator>YADAGIRI, G ; GOSWAMI, K. K ; GURUMURTHY, K. S ; SATYAM, M ; SHANKARA, K. N</creator><contributor>WCA</contributor><creatorcontrib>YADAGIRI, G ; GOSWAMI, K. K ; GURUMURTHY, K. S ; SATYAM, M ; SHANKARA, K. N ; WCA</creatorcontrib><description>Multilayer thick-film technology is one of the important technologies adopted in the miniaturization of electronic systems. Generally, only interconnections are made in the intermediate layers. The possibility of fabricating resistors along with interconnections in the buried layers/intermediate layers using conventional thick-film materials has been examined in this study. The fabrication has been carried out by processing layer after layer. It has been found that the buried layer resistors exhibited a sheet resistivity lower than those fabricated as open resistors. This change in sheet resistivity has been attributed to multiple firings that the resistors undergo during the fabrication. This reduction in sheet resistivity has been found to be due to segregation of active materials. A model has been proposed to explain this change in sheet resistivity through segregation of the active material. The work reported in the paper clearly indicates that buried resistors with consistent values (±10%) can be fabricated using conventional materials. However, the design of the resistors has to be carried out using modified sheet resistivities. The model that is proposed also indicates how one can make a paste that is likely to exhibit the same sheet resistivity for buried resistors and open resistors.[PUBLICATION ABSTRACT]</description><identifier>ISSN: 0957-4522</identifier><identifier>EISSN: 1573-482X</identifier><identifier>DOI: 10.1023/A:1020112501154</identifier><language>eng</language><publisher>Norwell, MA: Springer</publisher><subject>Applied sciences ; Electrical resistivity ; Electronic equipment and fabrication. Passive components, printed wiring boards, connectics ; Electronic systems ; Electronics ; Exact sciences and technology ; Interconnections ; Multilayers ; Pastes ; Resistors ; Segregations ; Studies</subject><ispartof>Journal of materials science. Materials in electronics, 2002-10, Vol.13 (10), p.615-620</ispartof><rights>2003 INIST-CNRS</rights><rights>Kluwer Academic Publishers 2002</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>315,782,786,27931,27932</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=14439070$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><contributor>WCA</contributor><creatorcontrib>YADAGIRI, G</creatorcontrib><creatorcontrib>GOSWAMI, K. K</creatorcontrib><creatorcontrib>GURUMURTHY, K. S</creatorcontrib><creatorcontrib>SATYAM, M</creatorcontrib><creatorcontrib>SHANKARA, K. N</creatorcontrib><title>Studies on buried layer resistors</title><title>Journal of materials science. Materials in electronics</title><description>Multilayer thick-film technology is one of the important technologies adopted in the miniaturization of electronic systems. Generally, only interconnections are made in the intermediate layers. The possibility of fabricating resistors along with interconnections in the buried layers/intermediate layers using conventional thick-film materials has been examined in this study. The fabrication has been carried out by processing layer after layer. It has been found that the buried layer resistors exhibited a sheet resistivity lower than those fabricated as open resistors. This change in sheet resistivity has been attributed to multiple firings that the resistors undergo during the fabrication. This reduction in sheet resistivity has been found to be due to segregation of active materials. A model has been proposed to explain this change in sheet resistivity through segregation of the active material. The work reported in the paper clearly indicates that buried resistors with consistent values (±10%) can be fabricated using conventional materials. However, the design of the resistors has to be carried out using modified sheet resistivities. The model that is proposed also indicates how one can make a paste that is likely to exhibit the same sheet resistivity for buried resistors and open resistors.[PUBLICATION ABSTRACT]</description><subject>Applied sciences</subject><subject>Electrical resistivity</subject><subject>Electronic equipment and fabrication. Passive components, printed wiring boards, connectics</subject><subject>Electronic systems</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Interconnections</subject><subject>Multilayers</subject><subject>Pastes</subject><subject>Resistors</subject><subject>Segregations</subject><subject>Studies</subject><issn>0957-4522</issn><issn>1573-482X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2002</creationdate><recordtype>article</recordtype><sourceid>AFKRA</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><recordid>eNqN0D1PwzAQBmALgUQozKwBCcQSsM92zmarKr6kSgx0YIuc5CylSpNiJ0P_PanoxIBY7l0e3Rdjl4LfCw7yYf44BRcC9FS0OmKJ0CgzZeDzmCXcasyUBjhlZzGuOee5kiZhVx_DWDcU075LyzE0VKet21FIA8UmDn2I5-zEuzbSxSFnbPX8tFq8Zsv3l7fFfJltJddDBto79KbymAvpa6OFK3OSxAk0EPBaOlMpL0shRVUayp1RtVLOlJZg2mXGbn_abkP_NVIcik0TK2pb11E_xgIQAaXA_8DpD9ZO8O5PKHIUAGj0nl7_out-DN10bmGMMog23w--OSAXK9f64LqqicU2NBsXdoVQSlqOXH4D7_R0vw</recordid><startdate>20021001</startdate><enddate>20021001</enddate><creator>YADAGIRI, G</creator><creator>GOSWAMI, K. K</creator><creator>GURUMURTHY, K. S</creator><creator>SATYAM, M</creator><creator>SHANKARA, K. N</creator><general>Springer</general><general>Springer Nature B.V</general><scope>IQODW</scope><scope>7SP</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>8FE</scope><scope>8FG</scope><scope>ABJCF</scope><scope>AFKRA</scope><scope>ARAPS</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>F28</scope><scope>FR3</scope><scope>HCIFZ</scope><scope>JG9</scope><scope>KB.</scope><scope>L7M</scope><scope>P5Z</scope><scope>P62</scope><scope>PDBOC</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope><scope>S0W</scope><scope>7QQ</scope><scope>H8D</scope></search><sort><creationdate>20021001</creationdate><title>Studies on buried layer resistors</title><author>YADAGIRI, G ; GOSWAMI, K. K ; GURUMURTHY, K. S ; SATYAM, M ; SHANKARA, K. N</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-p305t-25fa7f8cf7613fd851ab6e3e0e252e20d3a8c4f3b131cb8e6a84d44a8b9e2643</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2002</creationdate><topic>Applied sciences</topic><topic>Electrical resistivity</topic><topic>Electronic equipment and fabrication. Passive components, printed wiring boards, connectics</topic><topic>Electronic systems</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Interconnections</topic><topic>Multilayers</topic><topic>Pastes</topic><topic>Resistors</topic><topic>Segregations</topic><topic>Studies</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>YADAGIRI, G</creatorcontrib><creatorcontrib>GOSWAMI, K. K</creatorcontrib><creatorcontrib>GURUMURTHY, K. S</creatorcontrib><creatorcontrib>SATYAM, M</creatorcontrib><creatorcontrib>SHANKARA, K. N</creatorcontrib><collection>Pascal-Francis</collection><collection>Electronics & Communications Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central UK/Ireland</collection><collection>Advanced Technologies & Aerospace Collection</collection><collection>ProQuest Central</collection><collection>Technology Collection (ProQuest)</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><collection>SciTech Premium Collection</collection><collection>Materials Research Database</collection><collection>Materials Science Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Advanced Technologies & Aerospace Database</collection><collection>ProQuest Advanced Technologies & Aerospace Collection</collection><collection>Materials Science Collection</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central China</collection><collection>DELNET Engineering & Technology Collection</collection><collection>Ceramic Abstracts</collection><collection>Aerospace Database</collection><jtitle>Journal of materials science. Materials in electronics</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>YADAGIRI, G</au><au>GOSWAMI, K. K</au><au>GURUMURTHY, K. S</au><au>SATYAM, M</au><au>SHANKARA, K. N</au><au>WCA</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Studies on buried layer resistors</atitle><jtitle>Journal of materials science. Materials in electronics</jtitle><date>2002-10-01</date><risdate>2002</risdate><volume>13</volume><issue>10</issue><spage>615</spage><epage>620</epage><pages>615-620</pages><issn>0957-4522</issn><eissn>1573-482X</eissn><abstract>Multilayer thick-film technology is one of the important technologies adopted in the miniaturization of electronic systems. Generally, only interconnections are made in the intermediate layers. The possibility of fabricating resistors along with interconnections in the buried layers/intermediate layers using conventional thick-film materials has been examined in this study. The fabrication has been carried out by processing layer after layer. It has been found that the buried layer resistors exhibited a sheet resistivity lower than those fabricated as open resistors. This change in sheet resistivity has been attributed to multiple firings that the resistors undergo during the fabrication. This reduction in sheet resistivity has been found to be due to segregation of active materials. A model has been proposed to explain this change in sheet resistivity through segregation of the active material. The work reported in the paper clearly indicates that buried resistors with consistent values (±10%) can be fabricated using conventional materials. However, the design of the resistors has to be carried out using modified sheet resistivities. The model that is proposed also indicates how one can make a paste that is likely to exhibit the same sheet resistivity for buried resistors and open resistors.[PUBLICATION ABSTRACT]</abstract><cop>Norwell, MA</cop><pub>Springer</pub><doi>10.1023/A:1020112501154</doi><tpages>6</tpages></addata></record> |
fulltext | fulltext |
identifier | ISSN: 0957-4522 |
ispartof | Journal of materials science. Materials in electronics, 2002-10, Vol.13 (10), p.615-620 |
issn | 0957-4522 1573-482X |
language | eng |
recordid | cdi_proquest_miscellaneous_27727317 |
source | SpringerNature Journals |
subjects | Applied sciences Electrical resistivity Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronic systems Electronics Exact sciences and technology Interconnections Multilayers Pastes Resistors Segregations Studies |
title | Studies on buried layer resistors |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-05T14%3A04%3A04IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_pasca&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Studies%20on%20buried%20layer%20resistors&rft.jtitle=Journal%20of%20materials%20science.%20Materials%20in%20electronics&rft.au=YADAGIRI,%20G&rft.date=2002-10-01&rft.volume=13&rft.issue=10&rft.spage=615&rft.epage=620&rft.pages=615-620&rft.issn=0957-4522&rft.eissn=1573-482X&rft_id=info:doi/10.1023/A:1020112501154&rft_dat=%3Cproquest_pasca%3E2433711511%3C/proquest_pasca%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=884877967&rft_id=info:pmid/&rfr_iscdi=true |