Relationships between thermally induced residual stresses and architecture of epoxy-amine model networks

The capability of epoxy‐amine resins to develop residual stresses was studied as a function of temperature and network architecture. These residual stresses were induced while cooling epoxy‐glass bilayers from temperatures higher than the network glass transition temperature, Tg. This behavior was t...

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Veröffentlicht in:	Journal of applied polymer science 2000-01, Vol.75 (5), p.638-650
Hauptverfasser:	Bauchiere, Didier, Halary, Jean Louis, Monnerie, Lucien, Schirrer, Robert
Format:	Artikel
Sprache:	eng
Schlagworte:	antiplasticizer Applied sciences epoxy networks Exact sciences and technology glass transition Organic polymers Physicochemistry of polymers Properties and characterization residual stresses secondary relaxation Thermal and thermodynamic properties thermal expansion coefficient thermoplastic-filled epoxies viscoelastic behavior
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