A new approach to rectangle-packing

The rectangle‐packing problem is the problem of placing several given rectangles of arbitrary width and height into a minimum area rectangle without overlapping. This problem can be applied to VLSI packaging design, for which the area significantly affects the fabrication cost. Since this is an NP‐h...

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Veröffentlicht in:	Electronics & communications in Japan. Part 3, Fundamental electronic science Fundamental electronic science, 2000-12, Vol.83 (12), p.94-104
Hauptverfasser:	Nagao, Akira, Sawa, Takashi, Shigehiro, Yuji, Shirakawa, Isao, Kambe, Takashi
Format:	Artikel
Sprache:	eng
Schlagworte:	CAD floor plan LSI packing rectangle-packing
Online-Zugang:	Volltext
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