Non-destructive examination of adhesively bonded structures using dielectric techniques: Review and some results

Abstract The use of high-frequency dielectric measurements is described for the non-destructive evaluation of adhesively bonded structures. Frequency domain measurements have been used to monitor the ingress of moisture into the joint structure. A good correlation has been observed between the data...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Proceedings of the Institution of Mechanical Engineers. Part C, Journal of mechanical engineering science Journal of mechanical engineering science, 2000-01, Vol.214 (1), p.87-102
Hauptverfasser: Affrossman, S, Banks, W. M., Hayward, D, Pethrick, R. A.
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!