Non-destructive examination of adhesively bonded structures using dielectric techniques: Review and some results
Abstract The use of high-frequency dielectric measurements is described for the non-destructive evaluation of adhesively bonded structures. Frequency domain measurements have been used to monitor the ingress of moisture into the joint structure. A good correlation has been observed between the data...
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Veröffentlicht in: | Proceedings of the Institution of Mechanical Engineers. Part C, Journal of mechanical engineering science Journal of mechanical engineering science, 2000-01, Vol.214 (1), p.87-102 |
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Format: | Artikel |
Sprache: | eng |
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