Enhanced Thermal Conductivity of Epoxy Composites by Introducing 1D AlN Whiskers and Constructing Directionally Aligned 3D AlN Filler Skeletons

With the miniaturization of current electronic products, ceramic/polymer composites with excellent thermal conductivity have attracted increasing attention. For regular ceramic particles as fillers, it is necessary to achieve the highest filling fraction to obtain high thermal conductivity, yet lead...

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Veröffentlicht in:	ACS applied materials & interfaces 2023-01, Vol.15 (1), p.2124-2133
Hauptverfasser:	Hao, Xu, Wan, Shiqin, Zhao, Zheng, Zhu, Lifeng, Peng, Dongyao, Yue, Ming, Kuang, Jianlei, Cao, Wenbin, Liu, Guanghua, Wang, Qi
Format:	Artikel
Sprache:	eng
Schlagworte:	Applications of Polymer, Composite, and Coating Materials
Online-Zugang:	Volltext
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