Fabrication, Microstructure and Stress Effects in Sputtered TiNi Thin Films
Sputtered thin films of equiatomic TiNi and TiNi(x) ternary alloys have excellent mechanical properties and exhibit robust shape-memory and transformational superelasticity. Furthermore, the energetic nature of the sputter deposition process allows the creation of highly refined microstructures that...
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Veröffentlicht in: | Materials science forum 2000-01, Vol.327-328, p.295-302 |
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description | Sputtered thin films of equiatomic TiNi and TiNi(x) ternary alloys have excellent mechanical properties and exhibit robust shape-memory and transformational superelasticity. Furthermore, the energetic nature of the sputter deposition process allows the creation of highly refined microstructures that are difficult to achieve by melt-solidification. This paper presents recent work on the relationship between processing, microstructure, and properties of binary TiNi thin films, focusing primarily on residual stresses, kinetics of stress-relaxation and crystallization, and fine grain sizes achievable using hot-substrate direct crystallization. (Author) |
doi_str_mv | 10.4028/www.scientific.net/MSF.327-328.295 |
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fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_miscellaneous_27527203</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>27527203</sourcerecordid><originalsourceid>FETCH-LOGICAL-c398t-9e9ecf27905862cfc00c1fd2fe6412aa1dcb98ee6a62e734aa386a9b28a180b03</originalsourceid><addsrcrecordid>eNqVkE1P4zAQhi0-JArsf8gB7QFtgj1OHPu4WyggWji0e7ZcdyyM0qRrO6r232NUJM4cRiONHr2v5iHkmtGqpiBv9vt9Fa3HPnnnbdVjulksZxWHtuQgK1DNEZkwIaBUbQPH5JzKVtZKNkyckAmFpimbuhVn5DzGN0o5k0xMyNPMrIO3Jvmh_1UsvA1DTGG0aQxYmH5TLFPAGIs759CmWPi-WO7GlDDgplj5Z1-sXvNt5rttvCSnznQRf3zuC_J3dreaPpTzl_vH6e95abmSqVSo0DpoFW2kAOsspZa5DTgUNQNj2MaulUQURgC2vDaGS2HUGqRhkq4pvyA_D7m7MPwbMSa99dFi15kehzFqyP-3QHkG_xzAj69iQKd3wW9N-K8Z1R9SdZaqv6TqLFVnqTpLzSN1lppDrj7bTLSmc8H01sevJNYKDpCx2wOWMhAT2lf9NoyhzyK-0_YOJH6Vtw</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>27527203</pqid></control><display><type>article</type><title>Fabrication, Microstructure and Stress Effects in Sputtered TiNi Thin Films</title><source>Scientific.net Journals</source><creator>Grummon, D.S.</creator><creatorcontrib>Grummon, D.S.</creatorcontrib><description>Sputtered thin films of equiatomic TiNi and TiNi(x) ternary alloys have excellent mechanical properties and exhibit robust shape-memory and transformational superelasticity. Furthermore, the energetic nature of the sputter deposition process allows the creation of highly refined microstructures that are difficult to achieve by melt-solidification. This paper presents recent work on the relationship between processing, microstructure, and properties of binary TiNi thin films, focusing primarily on residual stresses, kinetics of stress-relaxation and crystallization, and fine grain sizes achievable using hot-substrate direct crystallization. (Author)</description><identifier>ISSN: 0255-5476</identifier><identifier>ISSN: 1662-9752</identifier><identifier>ISBN: 0878498516</identifier><identifier>ISBN: 9780878498512</identifier><identifier>EISSN: 1662-9752</identifier><identifier>DOI: 10.4028/www.scientific.net/MSF.327-328.295</identifier><identifier>CODEN: MSFOEP</identifier><language>eng</language><publisher>Aedermannsdorf: Trans Tech Publications Ltd</publisher><subject>Applied sciences ; Condensed matter: structure, mechanical and thermal properties ; Exact sciences and technology ; Mechanical and acoustical properties ; Metals. Metallurgy ; Physical properties of thin films, nonelectronic ; Physics ; Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</subject><ispartof>Materials science forum, 2000-01, Vol.327-328, p.295-302</ispartof><rights>2000 Trans Tech Publications Ltd</rights><rights>2000 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c398t-9e9ecf27905862cfc00c1fd2fe6412aa1dcb98ee6a62e734aa386a9b28a180b03</citedby></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Uhttps://www.scientific.net/Image/TitleCover/401?width=600</thumbnail><link.rule.ids>309,310,314,777,781,786,787,23911,23912,25121,27905,27906</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=1176322$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Grummon, D.S.</creatorcontrib><title>Fabrication, Microstructure and Stress Effects in Sputtered TiNi Thin Films</title><title>Materials science forum</title><description>Sputtered thin films of equiatomic TiNi and TiNi(x) ternary alloys have excellent mechanical properties and exhibit robust shape-memory and transformational superelasticity. Furthermore, the energetic nature of the sputter deposition process allows the creation of highly refined microstructures that are difficult to achieve by melt-solidification. This paper presents recent work on the relationship between processing, microstructure, and properties of binary TiNi thin films, focusing primarily on residual stresses, kinetics of stress-relaxation and crystallization, and fine grain sizes achievable using hot-substrate direct crystallization. (Author)</description><subject>Applied sciences</subject><subject>Condensed matter: structure, mechanical and thermal properties</subject><subject>Exact sciences and technology</subject><subject>Mechanical and acoustical properties</subject><subject>Metals. Metallurgy</subject><subject>Physical properties of thin films, nonelectronic</subject><subject>Physics</subject><subject>Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</subject><issn>0255-5476</issn><issn>1662-9752</issn><issn>1662-9752</issn><isbn>0878498516</isbn><isbn>9780878498512</isbn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2000</creationdate><recordtype>article</recordtype><recordid>eNqVkE1P4zAQhi0-JArsf8gB7QFtgj1OHPu4WyggWji0e7ZcdyyM0qRrO6r232NUJM4cRiONHr2v5iHkmtGqpiBv9vt9Fa3HPnnnbdVjulksZxWHtuQgK1DNEZkwIaBUbQPH5JzKVtZKNkyckAmFpimbuhVn5DzGN0o5k0xMyNPMrIO3Jvmh_1UsvA1DTGG0aQxYmH5TLFPAGIs759CmWPi-WO7GlDDgplj5Z1-sXvNt5rttvCSnznQRf3zuC_J3dreaPpTzl_vH6e95abmSqVSo0DpoFW2kAOsspZa5DTgUNQNj2MaulUQURgC2vDaGS2HUGqRhkq4pvyA_D7m7MPwbMSa99dFi15kehzFqyP-3QHkG_xzAj69iQKd3wW9N-K8Z1R9SdZaqv6TqLFVnqTpLzSN1lppDrj7bTLSmc8H01sevJNYKDpCx2wOWMhAT2lf9NoyhzyK-0_YOJH6Vtw</recordid><startdate>20000101</startdate><enddate>20000101</enddate><creator>Grummon, D.S.</creator><general>Trans Tech Publications Ltd</general><general>Trans Tech Publications</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>8FD</scope><scope>H8D</scope><scope>L7M</scope></search><sort><creationdate>20000101</creationdate><title>Fabrication, Microstructure and Stress Effects in Sputtered TiNi Thin Films</title><author>Grummon, D.S.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c398t-9e9ecf27905862cfc00c1fd2fe6412aa1dcb98ee6a62e734aa386a9b28a180b03</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2000</creationdate><topic>Applied sciences</topic><topic>Condensed matter: structure, mechanical and thermal properties</topic><topic>Exact sciences and technology</topic><topic>Mechanical and acoustical properties</topic><topic>Metals. Metallurgy</topic><topic>Physical properties of thin films, nonelectronic</topic><topic>Physics</topic><topic>Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Grummon, D.S.</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Technology Research Database</collection><collection>Aerospace Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Materials science forum</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Grummon, D.S.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Fabrication, Microstructure and Stress Effects in Sputtered TiNi Thin Films</atitle><jtitle>Materials science forum</jtitle><date>2000-01-01</date><risdate>2000</risdate><volume>327-328</volume><spage>295</spage><epage>302</epage><pages>295-302</pages><issn>0255-5476</issn><issn>1662-9752</issn><eissn>1662-9752</eissn><isbn>0878498516</isbn><isbn>9780878498512</isbn><coden>MSFOEP</coden><abstract>Sputtered thin films of equiatomic TiNi and TiNi(x) ternary alloys have excellent mechanical properties and exhibit robust shape-memory and transformational superelasticity. Furthermore, the energetic nature of the sputter deposition process allows the creation of highly refined microstructures that are difficult to achieve by melt-solidification. This paper presents recent work on the relationship between processing, microstructure, and properties of binary TiNi thin films, focusing primarily on residual stresses, kinetics of stress-relaxation and crystallization, and fine grain sizes achievable using hot-substrate direct crystallization. (Author)</abstract><cop>Aedermannsdorf</cop><pub>Trans Tech Publications Ltd</pub><doi>10.4028/www.scientific.net/MSF.327-328.295</doi><tpages>8</tpages></addata></record> |
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subjects | Applied sciences Condensed matter: structure, mechanical and thermal properties Exact sciences and technology Mechanical and acoustical properties Metals. Metallurgy Physical properties of thin films, nonelectronic Physics Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties) |
title | Fabrication, Microstructure and Stress Effects in Sputtered TiNi Thin Films |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-20T09%3A24%3A24IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Fabrication,%20Microstructure%20and%20Stress%20Effects%20in%20Sputtered%20TiNi%20Thin%20Films&rft.jtitle=Materials%20science%20forum&rft.au=Grummon,%20D.S.&rft.date=2000-01-01&rft.volume=327-328&rft.spage=295&rft.epage=302&rft.pages=295-302&rft.issn=0255-5476&rft.eissn=1662-9752&rft.isbn=0878498516&rft.isbn_list=9780878498512&rft.coden=MSFOEP&rft_id=info:doi/10.4028/www.scientific.net/MSF.327-328.295&rft_dat=%3Cproquest_cross%3E27527203%3C/proquest_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=27527203&rft_id=info:pmid/&rfr_iscdi=true |