Stress field polarity effect on defects generation in thin silicon dioxide films

This work presents polarity effects during Fowler-Nordheim electric field stress on defect generation in thin silicon dioxide films and at the interface with the silicon. The results show a dissymmetry on interface state kinetic generation and the presence of a critical injected fluence at which the...

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Veröffentlicht in:Thin solid films 1997, Vol.296 (1), p.106-109
Hauptverfasser: El-Hdiy, A., Salace, G., Jourdain, M., Meinertzhagen, A., Vuillaume, D.
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container_end_page 109
container_issue 1
container_start_page 106
container_title Thin solid films
container_volume 296
creator El-Hdiy, A.
Salace, G.
Jourdain, M.
Meinertzhagen, A.
Vuillaume, D.
description This work presents polarity effects during Fowler-Nordheim electric field stress on defect generation in thin silicon dioxide films and at the interface with the silicon. The results show a dissymmetry on interface state kinetic generation and the presence of a critical injected fluence at which the dissymmetry is reversed. For injected fluences lower than this critical charge, the density of interface states created under positive gate bias is higher than that generated under negative bias, and if the injected charge is higher than the critical fluence the dissymmetry is reserved. However, the net oxide positive charge generated under positive bias is always lower than that created under negative bias.
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subjects Defects
Field polarity
Silicon dioxide
Stress
title Stress field polarity effect on defects generation in thin silicon dioxide films
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