Quantitative analysis of time-decay reproducible stress-induced leakage current in SiO sub(2) films

In the cases of both Fowler-Nordheim (FN) stress and substrate hot-hole stress, three reproducible stress-induced leakage current (SILC) components have been found for the repeated unipolar gate-voltage scans in 9.2-nm wet oxides. To clarify the mechanisms of these current components, a quantitative...

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Veröffentlicht in:IEEE transactions on electron devices 1997-01, Vol.44 (6), p.1002-1008
Hauptverfasser: Sakakibara, Kiyohiko, Ajika, Natsuo, Eikyu, Katsumi, Ishikawa, Kiyoshi, Miyoshi, Hirokazu
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container_issue 6
container_start_page 1002
container_title IEEE transactions on electron devices
container_volume 44
creator Sakakibara, Kiyohiko
Ajika, Natsuo
Eikyu, Katsumi
Ishikawa, Kiyoshi
Miyoshi, Hirokazu
description In the cases of both Fowler-Nordheim (FN) stress and substrate hot-hole stress, three reproducible stress-induced leakage current (SILC) components have been found for the repeated unipolar gate-voltage scans in 9.2-nm wet oxides. To clarify the mechanisms of these current components, a quantitative analysis has been developed. By precisely modeling the phonon assisted tunneling process, it has been shown that the E-J and t-J characteristics of the reproducible current components can be completely simulated as electron tunneling processes into the neutral traps, each with a single trap level. From this analysis, the physical parameters of the traps have been estimated with a reasonable degree of accuracy. Furthermore, the increase in distribution of the neutral trap density toward both the SiO sub(2) interfaces has also been estimated.
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title Quantitative analysis of time-decay reproducible stress-induced leakage current in SiO sub(2) films
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