Copper and copper compounds as coatings on polystyrene particles and as hollow spheres

Submicron-sized anionic polystyrene lattices have been coated with uniform layers of copper compounds by aging dispersions of the polymer colloid in the presence of aqueous solutions of Cu(NO sub 3 ) sub 2 , urea, and poly(N-vinylpyrrolidone) at 85 deg C. The thickness and morphology of the deposite...

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Veröffentlicht in:Journal of materials chemistry 2000-01, Vol.10 (10), p.2294-2297
Hauptverfasser: KAWAHASHI, Nobuo, SHIHO, Hiroshi
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SHIHO, Hiroshi
description Submicron-sized anionic polystyrene lattices have been coated with uniform layers of copper compounds by aging dispersions of the polymer colloid in the presence of aqueous solutions of Cu(NO sub 3 ) sub 2 , urea, and poly(N-vinylpyrrolidone) at 85 deg C. The thickness and morphology of the deposited layers can be altered by suitable adjustment of the reactant concentrations and the aging time. Hollow colloidal spheres of metallic copper and copper oxide were obtained by calcination of the coated polystyrene latices at elevated temperatures in nitrogen and air, respectively.
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source Royal Society of Chemistry Journals Archive (1841-2007); Royal Society Of Chemistry Journals 2008-
subjects Applied sciences
Cross-disciplinary physics: materials science
rheology
Exact sciences and technology
Liquid phase epitaxy
deposition from liquid phases (melts, solutions, and surface layers on liquids)
Materials science
Metals. Metallurgy
Methods of deposition of films and coatings
film growth and epitaxy
Physics
title Copper and copper compounds as coatings on polystyrene particles and as hollow spheres
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