Copper and copper compounds as coatings on polystyrene particles and as hollow spheres

Submicron-sized anionic polystyrene lattices have been coated with uniform layers of copper compounds by aging dispersions of the polymer colloid in the presence of aqueous solutions of Cu(NO sub 3 ) sub 2 , urea, and poly(N-vinylpyrrolidone) at 85 deg C. The thickness and morphology of the deposite...

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Veröffentlicht in:	Journal of materials chemistry 2000-01, Vol.10 (10), p.2294-2297
Hauptverfasser:	KAWAHASHI, Nobuo, SHIHO, Hiroshi
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Cross-disciplinary physics: materials science rheology Exact sciences and technology Liquid phase epitaxy deposition from liquid phases (melts, solutions, and surface layers on liquids) Materials science Metals. Metallurgy Methods of deposition of films and coatings film growth and epitaxy Physics
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Zusammenfassung:	Submicron-sized anionic polystyrene lattices have been coated with uniform layers of copper compounds by aging dispersions of the polymer colloid in the presence of aqueous solutions of Cu(NO sub 3 ) sub 2 , urea, and poly(N-vinylpyrrolidone) at 85 deg C. The thickness and morphology of the deposited layers can be altered by suitable adjustment of the reactant concentrations and the aging time. Hollow colloidal spheres of metallic copper and copper oxide were obtained by calcination of the coated polystyrene latices at elevated temperatures in nitrogen and air, respectively.
ISSN:	0959-9428 1364-5501
DOI:	10.1039/b000788i