Modeling vapor pressure effects on void rupture and crack growth resistance

The phenomenon of vapor pressure assisted void growth and rupture is studied. Plastic electronic packages absorb moisture which condenses within numerous micropores in the substrate, solder mask and die attach materials as well as near their interfaces. During reflow soldering, the condensed moistur...

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Veröffentlicht in:	Acta materialia 2002-08, Vol.50 (13), p.3487-3500
Hauptverfasser:	Guo, T.F., Cheng, L.
Format:	Artikel
Sprache:	eng
Schlagworte:	Condensed matter: structure, mechanical and thermal properties Exact sciences and technology Fatigue, brittleness, fracture, and cracks Finite element analysis Mechanical and acoustical properties of condensed matter Mechanical properties of solids Physics Polymers Porous material Toughness Void growth
Online-Zugang:	Volltext
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