A microbeam RBS analysis of low temperature direct-write inkjet deposited copper

Quantitative microbeam Rutherford backscattering (RBS) analysis with a 1.5 MeV 4 He + beam has determined limits on the purity of copper deposited on glass with a novel inkjet process. A tetravinyl silane tetrakisCu(I) 1,1,1,5,5,5-hexafluoroacetylacetonate (TVST[Cu]hfac) complex was heated to 70 °C...

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Veröffentlicht in:	Nuclear instruments & methods in physics research. Section B, Beam interactions with materials and atoms Beam interactions with materials and atoms, 2002-04, Vol.188 (1), p.141-145
Hauptverfasser:	Jeynes, C., Rozenberg, G.G., Speakman, S.P., Steinke, J.H.G.
Format:	Artikel
Sprache:	eng
Schlagworte:	CVD Electronics Markov chain Monte Carlo Organometallic PCB
Online-Zugang:	Volltext
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